at28hc256e-70pc ATMEL Corporation, at28hc256e-70pc Datasheet
at28hc256e-70pc
Available stocks
Related parts for at28hc256e-70pc
at28hc256e-70pc Summary of contents
Page 1
... Description The AT28HC256 is a high-performance electrically erasable and programmable read- only memory. Its 256K of memory is organized as 32,768 words by 8 bits. Manufac- tured with Atmel’s advanced nonvolatile CMOS technology, the AT28HC256 offers access times with power dissipation of just 440 mW. When the AT28HC256 is deselected, the standby current is less than 5 mA ...
Page 2
Pin Configurations Pin Name A0 - A14 I/ 2.1 28-lead TSOP Top View OE 1 A11 A13 VCC 7 A14 8 A12 9 A7 ...
Page 3
... The AT28HC256 is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state when either high. This dual-line control gives designers flexibility in preventing bus contention in their system ...
Page 4
... All command sequences must conform to the page write timing spec- ifications. It should also be noted that the data in the enable and disable command sequences is not written to the device and the memory addresses used in the sequence may be written with data in either a byte or page write operation. ...
Page 5
DC and AC Operating Range Ind. Operating Temperature (Case) Mil. V Power Supply CC 6. Operating Modes Mode Read (2) Write Standby/Write Inhibit Write Inhibit Write Inhibit Output Disable Chip Erase Notes can ...
Page 6
AC Read Characteristics Symbol Parameter t Address to Output Delay ACC ( Output Delay CE ( Output Delay OE (3)( Output Float DF Output Hold from OE, CE ...
Page 7
Input Test Waveforms and Measurement Level 12. Output Test Load 13. Pin Capacitance ( MHz 25°C Symbol Typ OUT Note: 1. This parameter is characterized and is not 100% ...
Page 8
AC Write Characteristics Symbol Parameter Address, OE Setup Time AS OES t Address Hold Time AH t Chip Select Setup Time CS t Chip Select Hold Time CH t Write Pulse Width (WE or CE) WP ...
Page 9
Page Mode Write Characteristics Symbol Parameter t Write Cycle Time (option available Address Setup Time AS t Address Hold Time AH t Data Setup Time DS t Data Hold Time DH t Write Pulse Width WP t ...
Page 10
Software Data Protection (1) Enable Algorithm LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA A0 TO ADDRESS 5555 WRITES ENABLED LOAD DATA XX TO (4) ANY ADDRESS LOAD LAST BYTE TO LAST ADDRESS ...
Page 11
Data Polling Characteristics Symbol Parameter t Data Hold Time Hold Time OEH ( Output Delay OE t Write Recovery Time WR Notes: 1. These parameters are characterized and not 100% tested. 2. See ...
Page 12
Normalized I Graphs CC AT28HC256 12 0007L–PEEPR–03/08 ...
Page 13
Ordering Information 27.1 Standard Package I (mA ACC (ns) Active Standby 0.3 120 80 0.3 28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip) 28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package ...
Page 14
Standard Package (Continued) I (mA ACC (ns) Active Standby 80 0 0.3 80 0.3 120 80 0.3 Note: 1. See “Valid Part Numbers” on page 28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip) ...
Page 15
Green Package Option (Pb/Halide-free) I (mA ACC (ns) Active Standby 0.3 120 80 0.3 32J 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28S 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) 28T ...
Page 16
... Device Numbers Speed AT28HC256 70 AT28HC256 90 AT28HC256E 90 AT28HC256F 90 AT28HC256 12 AT28HC256E 12 AT28HC256F 12 30. Die Products Reference Section: Parallel EEPROM Die Products AT28HC256 16 Options Package and Temperature Combinations JI, JU, PI, PU, SI, SU, TI, TU JI, JU, PI, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883 JI, JU, PI, PU, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883 ...
Page 17
Packaging Information 31.1 28D6 – Cerdip Dimensions in Millimeters and (Inches). Controlling dimension: Inches. MIL-STD 1835 D-10 Config A (Glass Sealed) 5.72(0.225) MAX SEATING PLANE 5.08(0.200) 3.18(0.125) 2.54(0.100)BSC 0.46(0.018) 0.20(0.008) 2325 Orchard Parkway San Jose, CA 95131 R 0007L–PEEPR–03/08 ...
Page 18
Flatpack Dimensions in Millimeters and (Inches). Controlling dimension: Inches. MIL-STD 1835 F-12 Config B PIN #1 ID 18.49(0.728) 18.08(0.712) 10.57(0.416) 0.23(0.009) 0.10(0.004) 2325 Orchard Parkway San Jose, CA 95131 R AT28HC256 18 9.75(0.384) 1.96(0.077) 1.09(0.043) 7.26(0.286) 6.96(0.274) ...
Page 19
PLCC 1.14(0.045) X 45˚ 0.51(0.020)MAX 45˚ MAX (3X) Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per ...
Page 20
LCC Dimensions in Millimeters and (Inches). Controlling dimension: Inches. MIL-STD 1835 C-12 14.22(0.560) 13.72(0.540) 10.16(0.400) BSC 1.27(0.050) TYP 2325 Orchard Parkway San Jose, CA 95131 R AT28HC256 20 11.63(0.458) 11.23(0.442) PIN 1 1.40(0.055) 1.14(0.045) 2.41(0.095) 1.91(0.075) 0.305(0.012) ...
Page 21
PDIP A SEATING PLANE Notes: 1. This package conforms to JEDEC reference MS-011, Variation AB. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed ...
Page 22
SOIC Dimensions in Millimeters and (Inches). Controlling dimension: Millimeters. 2325 Orchard Parkway San Jose, CA 95131 R AT28HC256 22 0.51(0.020) 0.33(0.013) 7.60(0.2992) 7.40(0.2914) PIN 1 1.27(0.50) BSC TOP VIEW 18.10(0.7125) 17.70(0.6969) 0.30(0.0118) 0.10(0.0040) 0º ~ 8º 1.27(0.050) ...
Page 23
TSOP Pin 1 Identifier Area e E Notes: 1. This package conforms to JEDEC reference MO-183. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion 0.15 mm per side and on ...
Page 24
PGA Dimensions in Millimeters and (Inches). Controlling dimension: Inches. 16.71(0.658) 16.31(0.642) 2325 Orchard Parkway San Jose, CA 95131 R AT28HC256 24 13.74(0.540) 2.57(0.101) 13.36(0.526) 2.06(0.081) 15.24(0.600) 14.88(0.586) 14.17(0.558) 13.77(0.542) 2.54(0.100) TYP 12.70(0.500) TYP 2.54(0.100) TYP 10.41(0.410) 9.91(0.390) ...
Page 25
... Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2008 Atmel Corporation. All rights reserved. Atmel Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. International Atmel Asia ...