24lc00t-st Microchip Technology Inc., 24lc00t-st Datasheet - Page 12

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24lc00t-st

Manufacturer Part Number
24lc00t-st
Description
128-bit I2c Bus Serial Eeprom
Manufacturer
Microchip Technology Inc.
Datasheet
24AA00/24LC00/24C00
DS21178G-page 12
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
eB
A2
A1
E1
b1
E1
N
A
E
D
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.325
.280
.400
.150
.015
.070
.022
.430
.195
c

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