24lc01bt-st Microchip Technology Inc., 24lc01bt-st Datasheet - Page 19

• Manufacturer Part Number: 24lc01bt-st
• Description: 1k I2c Serial Eeprom
• Manufacturer: Microchip Technology Inc.

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
NOTE 2
EXPOSED PAD
Units
A1
A3
D2
E2
N
A
D
E
K
e
b
L
L
K
MIN
0.80
0.00
1.30
1.50
0.18
0.30
0.20
24AA01/24LC01B
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
0.50
1.75
1.90
0.30
–
E2
NOTE 1
DS21711G-page 19