mm8202 Integrated Device Technology, mm8202 Datasheet

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mm8202

Manufacturer Part Number
mm8202
Description
Cmos Oscillator
Manufacturer
Integrated Device Technology
Datasheet
The Preliminary Information presented herein represents a product in pre-production. The noted characteristics are based on initial product characterization and/or qualification.
Integrated Device Technology, Incorporated (IDT) reserves the right to change any circuitry or specifications without notice
Ordering Information
8202
1) IDT Base Part Number
2) FF: Factory Programmed Frequency in MHz
3) Supply Voltage Configuration
4) Output Signal Type
5) Package Options*
6) Temperature Grade
7) Tape & Reel Option
This product is rated “Green”. Please contact factory for environmental compliancy
information.
MM8202 REVISION C DATE, 07/21/2010
General Desription
Using the IDT CMOS Oscillator technology, originally developed by
Mobius Microsystems, the MM8202 replaces quartz crystal based
resonators and oscillators with a monolithic CMOS IC at the thinnest
possible form factors without the use of any mechanical frequency
source or PLL. The product is specially designed to work with the
next generation USB 2.0 High Speed, USB 2.0 Full/Low Speed and
USB-IC (USB-InterChip) interface controller ICs, and high density
SIM-, and smart-cards.
1
-
VP: 1.8V to 3.3V continuous operation
V: 3.3V only operation
T: 2.5V only operation
P: 1.8V only operation
C: CMOS Output
-D: Wafer form 200um thickness
-C: Wafer form 350um thickness
-E: Wafer form 750um thickness
NSG: 5x3.2, 4-Pin Package
NVG: 2.5x2.0, 4-Pin Package
M: SOIC, 8-Pin Package
“ “: 0 to 70
“R”: -20 to 85
“ “: Shipped in Tube i.e. default is blank
T: Shipped in Tape & Reel
12
2
VP
3
o
C Commercial Temperature Range i.e. default is blank
o
C Restricted Industrial Temperature Range
C
4
CMOS Oscillator
NSG
5
6
7
T
Pin Assignment
Features
• All-CMOS Temperature Compensated Oscillator
• TimeStak
• Ultra-low power operation (2mA typical at 1.8V supply)
• No quartz or PLL used: very low jitter performance leading to low
• Excellent reliability: Shock and vibration resistant
• Many frequencies are supported
• Factory programmable from 6 to 133MHz
Table 1. Pin Descriptions
1
1
2
3
4
No
MCP options (-D package option)
link Bit Error Rates (BER)
CE
VSS
OUT
VDD
Name
TM
: Available in die form for the thinnest and smallest
Input
Pullup
Power
Output
Power
Type
Chip Enable. Internal Pullup. MM8202 is
enabled when HIGH.When LOW, OUT has
a weak pull-down to GND internally
System Ground
Frequency Output
Power Supply. Use a 0.1µF decoupling
capacitor between VDD and VSS
PRELIMINARY DATA SHEET
©2010 Integrated Device Technology, Inc.
Description
MM8202

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mm8202 Summary of contents

Page 1

... CMOS Oscillator General Desription Using the IDT CMOS Oscillator technology, originally developed by Mobius Microsystems, the MM8202 replaces quartz crystal based resonators and oscillators with a monolithic CMOS IC at the thinnest possible form factors without the use of any mechanical frequency source or PLL. The product is specially designed to work with the next generation USB 2 ...

Page 2

... All required circuit elements other than those that are noted in the Pin Descriptions Table (Table.1) above are internal to the device. In addition to common package options in 5x3.2mm and 2.5x2.0mm dimensions, the MM8202 is offered in “wafer” form to be used in Chip- on-Board (CoB) and Multi-Chip-Package (MCP) configurations for space and cost-sensitive applications. IDT offers MM8202 in Known- Good-Die (KGD) format with all applicable test and manufacturing information to allow for rapid evaluation and use ...

Page 3

... Notes 1. Measured with a 50Ω to GND termination 2: Measured at 48MHz output frequency 3. The MM8202 will support continuous VDD operation from 1.62 to 3.6V. The device can be powered up with a supply voltage at any of the 3 main supply rails of 1.8V, 2.5V or 3.3V. 4. Measured over 1000 cycles per JEDEC standard 65 5. Electrical parameters are guaranteed by design and characterization over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500lfpm ...

Page 4

... Notes 1. Measured with a 50Ω to GND termination 2: Measured at 48MHz output frequency 3. The MM8202 will support continuous VDD operation from 1.62 to 3.6V. The device can be powered up with a supply voltage at any of the 3 main supply rails of 1.8V, 2.5V or 3.3V. 4. Measured over 1000 cycles per JEDEC standard 65 5. Electrical parameters are guaranteed by design and characterization over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500lfpm ...

Page 5

... Notes 1. Measured with a 50Ω to GND termination 2: Measured at 48MHz output frequency 3. The MM8202 will support continuous VDD operation from 1.62 to 3.6V. The device can be powered up with a supply voltage at any of the 3 main supply rails of 1.8V, 2.5V or 3.3V. 4. Measured over 1000 cycles per JEDEC standard 65 5. Electrical parameters are guaranteed by design and characterization over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500lfpm ...

Page 6

... MM8202 Preliminary Data Sheet Package Outline and Package Dimensions Package Outline for NSG -5.0x3.2x0.9mm, 4-pin package: Below is the recommended PCB land pattern for the MM8202 NSG package: MM8202 REVISION C DATE, 07/21/2010 6 ©2010 Integrated Device Technology, Inc. CMOS OSCILLATOR ...

Page 7

... MM8202 Preliminary Data Sheet Package Outline and Package Dimensions Package Outline for NVG -2.5x2.0x0.55mm, 4-pin package: Package Outline for SOIC, 8-pin package: MM8202 REVISION C DATE, 07/21/2010 7 ©2010 Integrated Device Technology, Inc. CMOS OSCILLATOR ...

Page 8

... MM8202 Preliminary Data Sheet Die Information: MM8202 is offered in “wafer” form (-E, -D and -C package options used in Chip-on-Board (CoB) and Multi-Chip-Package (MCP) designs. Please contact your IDT sales representative to obtain further information. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use ...

Page 9

... MM8202 Preliminary Data Sheet 6024 Silver Creek Valley Road Sales 800-345-7015 (inside USA) San Jose, California 95138 +408-284-8200 (outside USA) Fax: 408-284-2775 www.IDT.com DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice ...

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