SI5975DC-T1 Vishay Intertechnology, SI5975DC-T1 Datasheet

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SI5975DC-T1

Manufacturer Part Number
SI5975DC-T1
Description
Dual P-channel 12-V (d-s) Mosfet
Manufacturer
Vishay Intertechnology
Datasheet
Notes
a.
b.
c.
Document Number: 71320
S-21251—Rev. B, 05-Aug-02
PRODUCT SUMMARY
ABSOLUTE MAXIMUM RATINGS (T
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
Continuous Drain Current (T
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
THERMAL RESISTANCE RATINGS
M
Maximum Junction-to-Ambient
Maximum Junction-to-Foot (Drain)
V
Surface Mounted on 1” x 1” FR4 Board.
See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon-
nection.
Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
i
DS
--12
Ordering Information: Si5975DC-T1
(V)
J
ti
t A bi
D
1
0.127 @ V
0.164 @ V
1206-8 ChipFETt
D
0.086 @ V
J
J
a
a
1
t
= 150_C)
= 150_C)
a
a
Bottom View
D
r
S
Parameter
Parameter
2
DS(on)
1
Dual P-Channel 12-V (D-S) MOSFET
D
G
2
GS
GS
GS
1
a
a
S
= --2.5 V
= --1.8 V
(Ω)
= --4.5 V
2
1
G
2
a
b, c
A
= 25_C UNLESS OTHERWISE NOTED)
Steady State
Steady State
T
T
T
T
t ≤ 5 sec
I
Marking Code
A
A
A
A
D
--4.1
--3.4
--3.0
= 25_C
= 85_C
= 25_C
= 85_C
(A)
DD XX
Part # Code
Lot Traceability
and Date Code
Symbol
Symbol
T
R
R
R
J
V
V
I
P
P
, T
DM
thJA
thJF
I
I
I
DS
GS
D
D
S
D
D
stg
G
1
P-Channel MOSFET
Typical
5 secs
--1.8
--4.1
--3.0
2.1
1.1
50
90
30
S
D
1
1
--55 to 150
260
--12
8
--10
Steady State
Maximum
G
Vishay Siliconix
2
--0.9
P-Channel MOSFET
--3.1
--2.2
1.1
0.6
110
60
40
Si5975DC
D
S
2
2
www.vishay.com
Unit
Unit
_C/W
_C
_C
C/
W
W
V
V
A
A
2-1

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SI5975DC-T1 Summary of contents

Page 1

... Bottom View Ordering Information: Si5975DC-T1 ABSOLUTE MAXIMUM RATINGS (T Parameter Drain-Source Voltage Gate-Source Voltage a a Continuous Drain Current (T Continuous Drain Current (T = 150_C) = 150_C Pulsed Drain Current Continuous Source Current (Diode Conduction Maximum Power Dissipation ...

Page 2

... Si5975DC Vishay Siliconix SPECIFICATIONS (T = 25_C UNLESS OTHERWISE NOTED) J Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current Zero Gate Voltage Drain Current a On-State Drain Current a Drain-Source On-State Resistance a Forward Transconductance a Diode Forward Voltage b Dynamic Total Gate Charge Gate-Source Charge ...

Page 3

... J 1 0.0 0.2 0.4 0.6 0.8 1 Source-to-Drain Voltage (V) SD Document Number: 71320 S-21251—Rev. B, 05-Aug-02 1000 0.25 0.20 0.15 0.10 0. 25_C J 0.00 1.2 1.4 1.6 Si5975DC Vishay Siliconix Capacitance 800 C iss 600 400 C oss 200 C rss Drain-to-Source Voltage (V) DS On-Resistance vs. Junction Temperature 1.4 1.2 1.0 0.8 0.6 --50 ...

Page 4

... Si5975DC Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Threshold Voltage 0.25 0. 0.05 --0.05 --0.15 --50 -- Temperature (_C) J Normalized Thermal Transient Impedance, Junction-to-Ambient 2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0. Normalized Thermal Transient Impedance, Junction-to-Foot 2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse ...

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