el5223 Intersil Corporation, el5223 Datasheet - Page 11

• Manufacturer Part Number: el5223
• Description: 12mhz 4-, 8-, 10- And 12-channel Rail-to-rail Input-output Buffers
• Manufacturer: Intersil Corporation

Typical Performance Curves
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 19. LARGE SIGNAL TRANSIENT RESPONSE
1V/DIV
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
JEDEC JESD51-3 AND SEMI G42-88
(SINGLE LAYER) TEST BOARD
714mW
TEMPERATURE
θ
JA
25
QFN24
=140°C/W
AMBIENT TEMPERATURE (°C)
758mW
50
11
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
1µs/DIV
θ
JA
75
QFN32
=132°C/W
85
100
EL5123, EL5223, EL5323, EL5423
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
125
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
714mW
486mW
θ
JA
150
MSOP10
25
=206°C/W
θ
AMBIENT TEMPERATURE (°C)
JA
TSSOP20
=140°C/W
50
833mW
781mW
75
θ
JA
TSSOP24
85
=128°C/W
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT
100
θ
JA
TSSOP28
=120°C/W
2.5
1.5
0.5
1.4
1.2
0.8
0.6
0.4
0.2
125
3
2
1
0
1
0
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD, QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
2.703W
TEMPERATURE
1.333W
1.111W
870mW
θ
TEMPERATURE
JA
TSSOP20
θ
=95°C/W
JA
150
25
25
QFN24
=37°C/W
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
θ
JA
MSOP10
2.857W
=115°C/W
50
50
1.176W
θ
JA
75
75
QFN32
θ
=35°C/W
JA
TSSOP24
85
85
=85°C/W
100
100
θ
JA
TSSOP28
=75°C/W
125
125
May 3, 2007
150
150
FN7176.2