isd5100 Winbond Electronics Corp America, isd5100 Datasheet - Page 55

• Manufacturer Part Number: isd5100
• Description: Single-chip 1 To 16 Minutes Duration Voice Record/playback Devices With Digital Storage Capability
• Manufacturer: Winbond Electronics Corp America

For SOIC package :
PC board traces and the three chip capacitors are on the bottom side of the board.
For TSOP package :
Notes:
[1]
[2]
[3]
Note 3
capacitors per good engineering practice (typ. 50 to 100 uF).
V
V
Digital and Analog grounds tie together at power supply. The V
SSD
CCD
Note 1: V
separated back to the V
point..
Note 2: V
separate back to the V
point.
Note 3: The Digital and Analog grounds
tie together at the power supply. The
V
filter capacitors per good engineering
practice (typ. 50 to 100 uF).
Note
CCA
V
[3]
V
traces should be kept separate back to the V
traces should be kept separated back to the V
7.6.4. PCB Layout Examples
CCD
SSD
(Digital Ground)
and V
V
S
S
D
SSD
CCD
CCD
traces should be kept
traces should be kept
Note
Note
[2]
[1]
supplies will also need
Note 1
CC
SS
Supply feed
1
supply feed
V
V
V
V
V
SSA
CCD
CCD
SSD
SSD
1
O
O
O
O
O
O
O
O
O
O
O
O
O
O
Analog Ground
CC
SS
- 55 -
supply feedpoint.
C3
C2
C1
supply feedpoint.
O
O
O
O
O
O
O
O
O
O
O
O
O
O
V
XCLK
SS A
Note 2
Note 3
C1=C2=C3=0.1 uF chip Capacitors
CCA
Publication Release Date: May 16, 2007
and V
To
V
ISD5100 SERIES
CCD
CC A
V
C
C
D
V
V
V
supplies will also need filter
SSA
SSA
CCA
Revision 1.4
V
V
CCA
SSA