hc5523 Intersil Corporation, hc5523 Datasheet - Page 21
hc5523
Manufacturer Part Number
hc5523
Description
Lssgr/tr57 Co/loop Carrier Slic With Low Power Standby
Manufacturer
Intersil Corporation
Datasheet
1.HC5523.pdf
(22 pages)
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Plastic Leaded Chip Carrier Packages (PLCC)
0.020 (0.51) MAX
3 PLCS
NOTES:
0.042 (1.07)
0.048 (1.22)
1. Controlling dimension: INCH. Converted millimeter dimensions are
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
not necessarily exact.
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
PIN (1) IDENTIFIER
0.045 (1.14)
MIN
C L
D1
D
0.026 (0.66)
0.032 (0.81)
0.050 (1.27) TP
VIEW “A” TYP.
21
0.042 (1.07)
0.056 (1.42)
E1
-C-
E
C L
0.025 (0.64)
MIN
0.013 (0.33)
0.021 (0.53)
contact point.
A
A1
-C-
0.004 (0.10)
D2/E2
D2/E2
0.025 (0.64)
0.045 (1.14)
SEATING
PLANE
VIEW “A”
0.020 (0.51)
MIN
HC5523
R
C
N28.45
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
A1
D1
D2
E1
E2
D
N
A
E
(JEDEC MS-018AB ISSUE A)
0.165
0.090
0.485
0.450
0.191
0.485
0.450
0.191
MIN
INCHES
28
MAX
0.180
0.120
0.495
0.456
0.219
0.495
0.456
0.219
12.32
11.43
12.32
11.43
MILLIMETERS
4.20
2.29
4.86
4.86
MIN
28
12.57
11.58
12.57
11.58
MAX
4.57
3.04
5.56
5.56
Rev. 2 11/97
NOTES
4, 5
4, 5
3
6
3
-
-
-
-