adg836 Analog Devices, Inc., adg836 Datasheet - Page 13

• Manufacturer Part Number: adg836
• Description: 0.5 ? Cmos 1.65 V To 3.6 V Dual Spdt/2 1 Mux
• Manufacturer: Analog Devices, Inc.

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG836YRM
ADG836YRM-REEL
ADG836YRM-REEL7
ADG836YRMZ
ADG836YRMZ-REEL
ADG836YRMZ-REEL7
ADG836YCP-REEL
ADG836YCP-REEL7
1
2
Branding on this package is limited to three characters due to space constraints.
Z = Pb-free part.
2
2
2
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
12 MAX
3.00 BSC
3.00 BSC
0.95
0.85
0.75
0.15
0.00
Figure 30. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
PIN 1
BSC SQ
COPLANARITY
Figure 29. 10-Lead Mini Small Outline Package [MSOP]
VIEW
TOP
0.30
0.23
0.18
3.00
10
0.80 MAX
0.65 TYP
0.27
0.17
0.10
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-187-BA
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
1
EXCEPT FOR EXPOSED PAD DIMENSION.
Dimensions shown in millimeters
Dimensions shown in millimeters
6
3 x 3 mm Body, Very Thin Quad
5
Package Description
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Lead Frame Chip Scale Package (LFCSP_VQ)
Lead Frame Chip Scale Package (LFCSP_VQ)
BSC SQ
4.90 BSC
0.20 REF
2.75
Rev. A | Page 13 of 16
1.10 MAX
SEATING
PLANE
0.05 MAX
0.02 NOM
(BOTTOM VIEW)
EXPOSED PAD
(CP-12-1)
(RM-10)
0.45
0.23
0.08
COPLANARITY
0.60 MAX
BSC
0.50
0.08
9
8
7
10
8°
0°
6
11
5
12
4
1
2
3
0.75
0.55
0.35
0.80
0.60
0.40
0.25 MIN
* 1.45
1.30 SQ
1.15
PIN 1
INDICATOR
Package Option
RM-10
RM-10
RM-10
RM-10
RM-10
RM-10
CP-12-1
CP-12-1
Branding
S9A
S9A
S9A
S05
S05
S05
S9A
S9A
ADG836
1