adg1611 Analog Devices, Inc., adg1611 Datasheet - Page 16

• Manufacturer Part Number: adg1611
• Description: 1 ? Typical On Resistance, ?5 V, +12 V, +5 V, And +3.3 V Quad Spst Switches
• Manufacturer: Analog Devices, Inc.

ADG1611/ADG1612/ADG1613
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1611BRUZ
ADG1611BRUZ-REEL
ADG1611BRUZ-REEL7
ADG1611BCPZ- REEL
ADG1611BCPZ-REEL7
ADG1612BRUZ
ADG1612BRUZ-REEL
ADG1612BRUZ-REEL7
ADG1612BCPZ- REEL
ADG1612BCPZ-REEL7
ADG1613BRUZ
ADG1613BRUZ-REEL
ADG1613BRUZ-REEL7
ADG1613BCPZ- REEL
ADG1613BCPZ-REEL7
1
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
INDICATOR
SEATING
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PLANE
1.00
0.85
0.80
PIN 1
12° MAX
0.15
0.05
D07981-0-1/09(0)
4.50
4.40
4.30
PIN 1
TOP VIEW
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 34. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC SQ
BSC
0.30
0.23
0.18
0.65
4.00
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
BSC SQ
0.20 REF
0.30
0.19
3.75
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
9
8
Rev. 0 | Page 16 of 16
1.20
MAX
SEATING
PLANE
6.40
BSC
BSC
0.65
(RU-16)
COPLANARITY
1.95 BCS
0.20
0.09
0.60 MAX
0.08
12
9
BOT TOM VIEW
13
8
EXPOSED
PAD
8°
0°
16
5
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
4
0.50
0.40
0.30
1
2.65
2.50 SQ
2.35
0.25 MIN
0.75
0.60
0.45
Package Option
RU-16
RU-16
RU-16
CP-16-13
CP-16-13
RU-16
RU-16
RU-16
CP-16-13
CP-16-13
RU-16
RU-16
RU-16
CP-16-13
CP-16-13