adg1609 Analog Devices, Inc., adg1609 Datasheet - Page 9

no-image

adg1609

Manufacturer Part Number
adg1609
Description
4.5 ? Ron, 4-/8-channel ?5 V,+12 V, +5 V, And +3.3 V Multiplexers
Manufacturer
Analog Devices, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
adg1609BCPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
adg1609BCPZ-REEL7
Manufacturer:
AD
Quantity:
1 340
Part Number:
adg1609BCPZ-REEL7
Manufacturer:
ADI
Quantity:
3 615
Part Number:
adg1609BCPZ-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
adg1609BRUZ
Manufacturer:
ADI
Quantity:
888
Part Number:
adg1609BRUZ
Manufacturer:
ADI
Quantity:
3 542
Part Number:
adg1609BRZ
Manufacturer:
ADI
Quantity:
3 543
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Table 8. ADG1608 Pin Function Descriptions
TSSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
N/A
Table 9. ADG1608 Truth Table
A2
X
0
0
0
0
1
1
1
1
1
X = don’t care.
1
Pin No.
LFCSP
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
EP
Figure 3. ADG1608 Pin Configuration (TSSOP)
V
EN
A0
S1
S2
S3
S4
SS
Mnemonic
A0
EN
V
S1
S2
S3
S4
D
S8
S7
S6
S5
V
GND
A2
A1
EP
D
SS
DD
A1
X
0
0
1
1
0
0
1
1
1
4
2
3
5
6
7
8
1
(Not to Scale)
ADG1608
TOP VIEW
Description
Logic Control Input.
Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin
is high, Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
Source Terminal 1. Can be an input or an output.
Source Terminal 2. Can be an input or an output.
Source Terminal 3. Can be an input or an output.
Source Terminal 4. Can be an input or an output.
Drain Terminal. Can be an input or an output.
Source Terminal 8. Can be an input or an output.
Source Terminal 7. Can be an input or an output.
Source Terminal 6. Can be an input or an output.
Source Terminal 5. Can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
16
15
14
13
12
11
10
9
A1
A2
GND
V
S5
S6
S7
S8
DD
A0
X
0
1
0
1
0
1
0
1
1
Rev. 0 | Page 9 of 20
EN
0
1
1
1
1
1
1
1
1
On Switch
None
1
2
3
4
5
6
7
8
Figure 4. ADG1608 Pin Configuration (LFCSP)
V
NOTES
1. THE EXPOSED PAD IS CONNECTED
S1
S2
S3
SS
INTERNALLY. FOR INCREASED
RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL
CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE SUBSTRATE, V
1
2
3
4
(Not to Scale)
ADG1608
TOP VIEW
PIN 1
INDICATOR
SS
ADG1608/ADG1609
.
12 GND
11 V
10 S5
9 S6
DD
SS
.

Related parts for adg1609