adg1436 Analog Devices, Inc., adg1436 Datasheet - Page 16

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adg1436

Manufacturer Part Number
adg1436
Description
1.8 ? Maximum On Resistance, ?15 V/12 V/?5 V, Icmos, Dual Spdt Switch
Manufacturer
Analog Devices, Inc.
Datasheet

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ADG1436
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1436YRUZ
ADG1436YRUZ-REEL7
ADG1436YCPZ-REEL
ADG1436YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
INDICATOR
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
SEATING
PLANE
1.00
0.85
0.80
PIN 1
0.15
0.05
12° MAX
4.50
4.40
4.30
PIN 1
Figure 36. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 35. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
TOP VIEW
BSC SQ
16
0.30
0.23
0.18
1
4.00
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
4 mm × 4 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
BSC SQ
0.20 REF
Rev. PrD | Page 16 of 17
3.75
9
8
1.20
MAX
0.80 MAX
0.65 TYP
Package Description
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
SEATING
PLANE
0.05 MAX
0.02 NOM
6.40
BSC
(CP-16-13)
(RU-16)
BSC
0.65
0.20
0.09
COPLANARITY
1.95 BCS
0.60 MAX
0.08
12
9
BOT TOM VIEW
13
8
EXPOSED
PAD
16
5
4
0.50
0.40
0.30
1
2.65
2.50 SQ
2.35
0.25 MIN
Preliminary Technical Data
0.75
0.60
0.45
Package Option
RU-16
RU-16
CP-16-13
CP-16-13

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