w83626f Winbond Electronics Corp America, w83626f Datasheet - Page 2

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w83626f

Manufacturer Part Number
w83626f
Description
Lpc To Isa Bridge Set
Manufacturer
Winbond Electronics Corp America
Datasheet
1. GENERAL DESCRIPTION
W83626F/W83626D/W83626G is a transparent LPC-to-ISA bus conversion IC.
For the new generation Intel chipset Camino and Whitney, SiS Super South 960, featuring LPC bus,
there is no support for ISA bus and slots. However, the demand of ISA devices still exists. For such case,
W83626F/G is the best companion solution for the non-ISA chipset. Also the packages of W83626F/G
had been chosen to be the most economic solution for save the M/B board layout size and cost.
For the new generation chipset featuring LPC interface and support no ISA bus, W83627HF/HG
(Winbond LPC I/O) together with the set of W83626F/G is the complete solution.
2. FEATURES
LPC to ISA Bridge
Package
Meet LPC Spec. 1.1
Support LDRQ# (LPC DMA), SERIRQ (serial IRQ)
Full ISA Bus Support except ISA Bus Masters, 16 bit I/O and Memory R/W
5V ISA and 3.3V LPC interfaces
All Software Transparent
IRQ Serializer for ISA Parallel IRQ transfer to Serial IRQ
Supports 3 fully ISA Compatible Slots without Buffering
LPC Bus at 33MHz
Supports Programmable ISA Bus Divide the PCI Clock into 3 or 4
All ISA Signals can be Isolated
14.318MHz in to generate two 14.318MHz buffer out and one 24.576MHz
Specific Keyboard Functions supported
Support 8 programmable general purpose I/O pins
Supports Configuration registers for programming performance
128-pin PQFP for W83626F
W83626F/W83626D/W83626G
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