w83627thg Winbond Electronics Corp America, w83627thg Datasheet - Page 108
w83627thg
Manufacturer Part Number
w83627thg
Description
Winbond Lpc I/o
Manufacturer
Winbond Electronics Corp America
Datasheet
1.W83627THG.pdf
(142 pages)
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Quantity
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Part Number:
W83627THG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
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CRF9 (Default 0x00)
CRFE, FF (Default 0x00)
Reserved for Winbond test.
7.3
CR30 (Default 0x00)
CR60, CR 61 (Default 0x00, 0x00)
These two registers select Hardware Monitor base address [0x100:0xFFF] on 8-byte boundary.
CR70 (Default 0x00)
Bit 0
Bit 7 - 3 : Reserved. Return zero when read.
Bit 2
Bit 1
Bit 0
Bit 7 - 1 : Reserved.
Bit 0
Bit 7 - 4 : Reserved.
Bit 3 - 0 : These bits select IRQ channel for Hardware Monitor.
Logical Device B (Hardware Monitor)
: IRQIN0EN.
= 0 disable the generation of an SMI / PME interrupt due to IRQIN0's IRQ.
= 1 enable the generation of an SMI / PME interrupt due to IRQIN0's IRQ.
: PME_EN: Select the power management events to be either an PME or SMI
interrupt for
the IRQ events. Note that: this bit is valid only when SMIPME_OE = 1.
= 0 the power management events will generate an SMI event
= 1 the power management events will generate an PME event.
: FSLEEP: This bit selects the fast expiry time of individual devices.
= 0 1 second.
= 1 8 mS
: SMIPME_OE: This is the SMI and PME output enable bit.
= 0 neither SMI nor PME will be generated. Only the IRQ status bit is set.
= 1 an SMI or PME event will be generated.
= 1 Activates the logical device.
= 0 Logical device is inactive.
- 101 -
W83627THF/W83627THG
Publication Release Date: September 26, 2006
Revision 1.2
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