hcpl-4100500 Avago Technologies, hcpl-4100500 Datasheet - Page 3

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hcpl-4100500

Manufacturer Part Number
hcpl-4100500
Description
Optically Coupled 20 Ma Current Loop Transmitter
Manufacturer
Avago Technologies
Datasheet
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4100)
Solder Reflow Thermal Profile
Figure 1. Solder Reflow Thermal Profile.
3
TEMPERATURE
ROOM
(0.043 ± 0.013)
1.080 ± 0.320
300
200
100
0
Note: Non-halide flux should be used.
0
(0.047)
MAX.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
1.19
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
160°C
150°C
140°C
1
8
(0.100)
BSC
50
2.54
(0.380 ± 0.010)
3°C + 1°C/–0.5°C
9.65 ± 0.25
7
2
PREHEATING TIME
150°C, 90 + 30 SEC.
6
3
2.5°C ± 0.5°C/SEC.
100
4
5
TIME (SECONDS)
(0.070)
1.780
MAX.
(0.140 ± 0.005)
(0.250 ± 0.010)
3.56 ± 0.13
6.350 ± 0.25
TEMP.
PEAK
245°C
(0.025 ± 0.005)
150
0.635 ± 0.130
SEC.
SEC.
30
30
LAND PATTERN RECOMMENDATION
50 SEC.
SOLDERING
200°C
TIME
200
1.27 (0.050)
PEAK
TEMP.
240°C
(0.380 ± 0.010)
(0.300 ± 0.010)
(0.025 ± 0.010)
0.635 ± 0.25
9.65 ± 0.25
7.62 ± 0.25
1.016 (0.040)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
12° NOM.
(0.010
0.254
2.0 (0.080)
10.9 (0.430)
+ 0.003)
- 0.002)
+ 0.076
- 0.051

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