hcpl-788j-560e Avago Technologies, hcpl-788j-560e Datasheet - Page 6

• Manufacturer Part Number: hcpl-788j-560e
• Description: Very High Cmr 2.5 Amp Output Current Igbt Gate Driver Optocoupler
• Manufacturer: Avago Technologies

Recommended Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
Regulatory Information
The ACPL-3130/J313 and ACNW3130 are pending approval by the following organizations:
IEC/EN/DIN EN 60747-5-2 (ACPL-3130 Option 060
only, ACPL-J313 and ACNW3130)
Approval under:
IEC 60747-5-2 :1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01

TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE TO BE 245 °C
smax
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
= 200 °C, T
t 25 °C to PEAK
60 to 180 SEC.
smin
PREHEAT
3 °C/SEC. MAX.
= 150 °C
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
2.5 C ± 0.5 °C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
245 °C
PEAK
UL
Approval under UL 1577, component recognition
program, File E55361.
CSA
Approval under CSA Component Acceptance Notice #5,
File CA 88324.
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
TEMP.
230 °C
PEAK
250