hcpl-273l-560e Avago Technologies, hcpl-273l-560e Datasheet - Page 5

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hcpl-273l-560e

Manufacturer Part Number
hcpl-273l-560e
Description
Low Input Current, High Gain, Lvttl/lvcmos Compatible Optocouplers
Manufacturer
Avago Technologies
Datasheet
Recommended Pb-Free IR Profile
Solder Reflow Temperature Profile
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
Approved under
5
TEMPERATURE
UL Approval under UL 1577, Component Recognition Program, File E55361.
CSA Approval under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (Option 060 only)
ROOM
NOTES:
THE TIME FROM 25
T
smax
T
T
smax
smin
300
200
100
= 200
25
T
T
p
0
L
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
217
°
C, T
PREHEATING RATE 3
REFLOW HEATING RATE 2.5
160
150
140
°
150 - 200
C
smin
°
°
°
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
C
C
C
= 150
°
C
t 25
60to180SEC.
°
PREHEAT
C
°
3
C to PEAK
°
t
°
s
C/SEC. MAX.
C + 1
50
RAMP-UP
3
°
°
C/-0.5
°
C ± 0.5
260 +0/-5
C + 1
°
TIME
°
C/SEC.
C/-0.5
150
°
PREHEATING TIME
C/SEC.
°
°
C, 90 + 30 SEC.
C
°
C
2.5
t
t
L
p
°
100
C ± 0.5
TIME (SECONDS)
°
C/SEC.
TIMEWITHIN 5
PEAKTEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6
°
C/SEC. MAX.
TEMP.
245
PEAK
°
C
°
C of ACTUAL
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200
TIME
200
°
C
PEAK
TEMP.
240
°
C
TIGHT
TYPICAL
LOOSE
TEMP.
230
PEAK
°
C
250

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