lx7205 Microsemi Corporation, lx7205 Datasheet - Page 3

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lx7205

Manufacturer Part Number
lx7205
Description
Integrated Emi Filters And Tvs Diodes
Manufacturer
Microsemi Corporation
Datasheet
Copyright © 2004
Rev. 1.0, 2004-10-05
Cu pad size
Pad Pitch
Pad Definition
Solder Mask Opening
Solder Stencil
Pad Protective Finish
Figure 2 – Solder Reflow Profile. Max Temperature is 240°C and maximum time above liquious (183°C) is 60 seconds
TM
240
o
C max
183
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
150
o
o
C
C
Parameter
Preheat Zone
Figure 1 – Recommended Non-Solder Mask Defined Pad
R E C O M M E N D E D P C B P A R A M E T E R S
~ 1min
Integrated Products Division
®
Microsemi
Flux Activation
~2 min
Zone
Non-Solder Mask Defined Cu
Integrated EMI Filter & ESD Protection For
Pad (OSP finish)
0.275 mm dia.
0.275 +0.0/-0.025 mm
0.5mm
Non-Solder Mask Defined
0.325 ± 0.025 mm
0.25 x 0.25 mm square,
0.125 mm thick, laser cut, electro-polished
OSP (Organic Surface Preservative)
Solder Mask Opening
0.325 mm dia.
Solder Reflow
Earpiece Speaker Ports
P
RODUCTION
~ 1min
Zone
D
Value
Cooling Zone
ATA
Time (s)
S
HEET
LX7205
Page 3

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