lm25085asdx National Semiconductor Corporation, lm25085asdx Datasheet - Page 20
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lm25085asdx
Manufacturer Part Number
lm25085asdx
Description
42v Constant On-time Pfet Buck Switching Controller With 0.9v Reference
Manufacturer
National Semiconductor Corporation
Datasheet
1.LM25085ASDX.pdf
(24 pages)
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PC Board Layout
In most applications, the heat sink pad or tab of Q1 is con-
nected to the switch node, i.e. the junction of Q1, L1 and D1.
While it is common to extend the PC board pad from under
these devices to aid in heat dissipation, the pad size should
be limited to minimize EMI radiation from this switching node.
If the PC board layout allows, a similarly sized copper pad can
be placed on the underside of the PC board, and connected
with as many vias as possible to aid in heat dissipation.
The voltage regulation, over-voltage, and current limit com-
parators are very fast and can respond to short duration noise
pulses. Layout considerations are therefore critical for opti-
mum performance. The layout must be as neat and compact
as possible with all the components as close as possible to
their associated pins. Two major current loops conduct cur-
rents which switch very fast, requiring the loops to be as small
as possible to minimize conducted and radiated EMI. The first
20
loop is that formed by C
second loop is that formed by D1, L1, C
The connection from the anode of D1 to the ground end of
C
to the VIN and GND pins, and C
sible to the VIN and VCC pins.
If the anticipated internal power dissipation of the LM25085A
will produce excessive junction temperatures during normal
operation, a package option with an exposed pad must be
used (MSOP-8EP or LLP-8). Effective use of the PC board
ground plane can help dissipate heat. Additionally, the use of
wide PC board traces, where possible, helps conduct heat
away from the IC. Judicious positioning of the PC board within
the end product, along with the use of any available air flow
(forced or natural convection) also helps reduce the junction
temperature.
IN
must be short and direct. C
IN
, Q1, L1, C
IN
VCC
must be as close as possible
OUT
must be as close as pos-
, and back to C
OUT
, and back to D1.
IN
. The