hsdl-2100 ETC-unknow, hsdl-2100 Datasheet - Page 9

• Manufacturer Part Number: hsdl-2100
• Description: Compliant Transceiver
• Manufacturer: ETC-unknow

Switching Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions
represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in
their operating range. All typical values are at 25 C and 5 V unless otherwise noted.
Notes:
1. For In-Band signals
2. For In-Band signals, 125 ns PW, 4 Mb/s, 4 PPM where 9.0 W/cm
3. Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse may
Reflow Profile
Figure 4 in page 10 is a straight
line representation of a nominal
temperature profile for a con-
vective IR reflow solder process.
The temperature profile is divided
into four process zones with four
rates. The T/ time temperature
change rates are detailed in Table
below Figure 4. The temperatures
are measured at the component
to printed-circuit (pc) board
connections.
In process zone P1, the pc board
and SMT HSDL-2100 castellation
I/O pins joints are heated to a
temperature of 125 C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 3 per second to allow
for even heating of both the pc
board and the SMT HSDL-2100
castellation I/O pins joints.
Transmitter Radiant
Intensity Pulse Width
Transmitter Radiant
Intensity Rise and Fall
Times
RXD-A Pulse Width
RXD-B Pulse Width
RXD-B Pulse Width (ASK)
Receiver Latency Time
T/ time temperature change
exceed 2 s in width, which will not affect correct demodulation of the data stream. An ASK and DASK system using the HSDL-2100 has
been shown to correctly receive all data bits for 9 W/cm
B channel only.
Parameter
115.2 Kb/s where 3.6 W/cm
tpw (IE)
t
t
tpw (RXD-A)
tpw (RXD-B)
t
t
r
f
L
L
(IE)
(IE),
(RXD-B)
(RXD-A)
Symbol
Process zone P2 should be of
sufficient time duration to dry
the solder paste. The temperature
is raised to a level just below
the liquidus point of the solder,
usually 170 C (338 F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230 C (446 F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder
and the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder connec-
tions becomes excessive, result-
ing in the formation of weak
2
EIL
Min.
115
1.5
0.7
75
2
1
<EI<500 mW/cm
500 mW/cm
Typ.
125
2
1.6
0.5
1
EI
2
.
500 mW/cm
Max.
135
175
1.8
7.5
1.3
40
2
1
incoming signal strength. ASK or DASK should use the RXD
2
Unit
.
ms
ns
ns
ns
s
s
s
9
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170 C (338 F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25 C (77 F) should not exceed
-3 C (-5.4 F) per second maxi-
mum. This limitation is necessary
to allow the pc board and SMT
HSDL-2100 castellation I/O pins
joints to change dimensions
evenly, putting minimal stresses
on the SMT HSDL-2100
transceiver packages.
tpw (TXD)=1.6 s at 115.2 K
pulses/second
tpw (TXD)=125 ns at 2.0 M
pulses/second
tpw (TXD)=125 ns at 2.0 M
pulses/second
[1]
[2]
[3]
carrier ASK
[1][2]
500 kHz/50% duty cycle
1/2
1/2
15
Conditions
15