hsdl-3208 LiteOn Technology Corp., hsdl-3208 Datasheet - Page 11

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hsdl-3208

Manufacturer Part Number
hsdl-3208
Description
Ultra Small Profile Package Irda Data Compliant Low Power 115.2 Kbit/s Infrared Transceiver
Manufacturer
LiteOn Technology Corp.
Datasheet

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11
Figure 16. Baking conditions chart.
Moisture Proof Packaging
All HSDL-3208 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4.
IS NECESSARY
NO BAKING
YES
PERFORM RECOMMENDED
OPENED (UNSEALED)
BAKING CONDITIONS
UNITS IN A SEALED
MOISTURE-PROOF
LESS THAN 30°C,
AND LESS THAN
THAN 72 HOURS
ENVIRONMENT
OPENED LESS
PACKAGE IS
PACKAGE IS
PACKAGE
60% RH
YES
NO
NO
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Baking should only be done once.
Recommended Storage
Conditions
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the recom-
mended storage conditions.
Package
In reels
In bulk
Storage
Temperature
Relative
Humidity
Temp.
60 C
100 C
125 C
150 C
10 C to 30 C
below 60% RH
Time
48 hours
4 hours
2 hours
1 hour

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