hsdl-3007 ETC-unknow, hsdl-3007 Datasheet - Page 12

• Manufacturer Part Number: hsdl-3007
• Description: Irda Data Compliant Low Power 115.2kbit/s With Remote Control Infrared Transceiver
• Manufacturer: ETC-unknow

Appendix B: PCB Layout Suggestion
The HSDL-3007 is a shieldless
part and hence does not
contain a shield trace unlike
the other transceivers. The
effects of EMI and power
supply noise can potentially
reduce the sensitivity of the
receiver, resulting in reduced
link distance. The following
PCB layout guidelines should
be followed to obtain a good
PSRR and EM immunity
resulting in good electrical
performance. Things to note:
1. The ground plane should be
2. VLED and Vcc can be
3. CX1 is generally a ceramic
4. Preferably a multi-layered
continuous under the part.
connected to either
unfiltered or unregulated
power supply. If VLED and
Vcc share the same power
supply, CX3 need not be
used. The connections for
CX1 and CX2 should be
connected before the current
limiting resistor R1.
capacitor of low inductance
providing a wide frequency
response while CX2 and
CX3 are tantalum capacitor
of big volume and fast
frequency response. The use
of a tantalum capacitor is
more critical on the VLED
line, which carries a high
current. CX4 is an optional
ceramic capacitor, similar to
CX1, for the IOVcc line.
board should be used to
provide sufficient ground
plane. Use the layer
underneath and near the
transceiver module as Vcc,
and sandwich that layer
between ground connected
board layers. The diagrams
below demonstrate an
example of a 4-layer board :
The area underneath the
module at the second layer,
and 3cm in all direction
around the module is defined
as the critical ground plane
zone. The ground plane should
be maximized in this zone.
Refer to application note
AN1114 or the Agilent IrDA
Data Link Design Guide for
details. The layout below is
based on a 2-layer PCB.
Top Layer
Top layer
Connect the module ground pin to bottom
ground layer
Layer 2
Critical ground plane zone. Do not connect
directly to the module ground pin
Layer 3
Keep data bus away from critical ground plane
zone
Bottom layer (GND)
Bottom Layer