v23818-k305-l55 Infineon Technologies Corporation, v23818-k305-l55 Datasheet - Page 12

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v23818-k305-l55

Manufacturer Part Number
v23818-k305-l55
Description
Small Form Factor Multimode 1.0625 Fibre Channel 1.25 Gigabit Ethernet Transceiver Pinning With Connector
Manufacturer
Infineon Technologies Corporation
Datasheet
V23818-K305-Lxx
Application Notes
line. An alternative termination can be provided with a 50 W resistor at each (D, Dn). In
DC coupled systems a thevenin equivalent 50 W resistance can be achieved as follows:
for 3.3 V: 125 W to
and 82 W to
, for 5 V: 82 W to
and 125 W to
V
V
V
V
at Data
CC
EE
CC
EE
and Datanot. Please consider whether there is an internal termination inside an IC or a
transceiver.
In certain cases signal GND is the most harmful source of radiation. Connecting chassis
GND and signal GND at the plate/ bezel/ chassis rear e.g. by means of a fiber optic
transceiver may result in a large amount of radiation. Even a capacitive coupling
between signal GND and chassis may be harmful if it is too close to an opening or an
aperture.
If a separation of signal GND and chassis GND is not planned, it is strongly
recommended to provide a proper contact between signal GND and chassis GND at
every location where possible. This concept is designed to avoid hotspots. Hotspots are
places of highest radiation which could be generated if only a few connections between
signal and chassis GND exist. Compensation currents would concentrate at these
connections, causing radiation.
By use of Gigabit switching components in a design, the return path of the RF current
must also be considered. Thus a split GND plane of Tx and Rx portion may result in
severe EMI problems.
A recommendation is to connect the housing leads to signal GND. However, in certain
applications it may improve EMI performance by connecting them to chassis GND.
The cutout should be sized so that all contact springs make good contact with the face
plate.
Please consider that the PCB may behave like a waveguide. With an e
of 4, the
r
wavelength of the harmonics inside the PCB will be half of that in free space. In this
scenario even the smallest PCBs may have unexpected resonances.
*)
(13.97)
.550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
File: 1501
Figure 6
Transceiver Pitch
Data Sheet
12
2003-01-22

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