max2247ebct Maxim Integrated Products, Inc., max2247ebct Datasheet - Page 9

• Manufacturer Part Number: max2247ebct
• Description: Max2247 2.4ghz Sige Linear Power Amplifier
• Manufacturer: Maxim Integrated Products, Inc.

To achieve optimum gain, output power, thermal perfor-
mance, and ACPR performance, ground vias should be
properly placed throughout the layout. Each ground pin
requires its own through-hole via (diameter = 10mils)
placed as near as possible to the device pin. This
reduces ground inductance, thermal resistance, and
feedback between stages. Use the MAX2247 EV kit PC
board layout as a guide.
The tiny chip-scale package (UCSP) represents a
unique package that greatly reduces board space
compared to other packages. UCSP reliability is inte-
grally linked to the user’s assembly methods, circuit
board material, and usage environment. Operating life
test and moisture resistance remains uncompromised,
as it is primarily determined by the wafer-fabrication
process. Mechanical stress performance is a greater
consideration for a UCSP. UCSP solder-joint contact
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2.4GHz SiGe Linear Power Amplifier
UCSP Reliability
Ground Vias
integrity must be considered because the package is
attached through direct solder contact to the user’s PC
board. Testing done to characterize the UCSP reliability
performance shows that it is capable of performing reli-
ably through environmental stresses. Users should also
be aware that as with any interconnect system there
are electromigration-based current limits that, in this
case, apply to the maximum allowable current in the
bumps. Reliability is a function of this current, the duty
cycle, lifetime, and bump temperature. See the
Absolute Maximum Ratings section for any specific lim-
itations listed under Continuous Operating Lifetime.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website at www.maxim-ic.com/1st_pages/UCSP.htm.
TRANSISTOR COUNT: 1425
Chip Information
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