saf-xc822t-1fri Infineon Technologies Corporation, saf-xc822t-1fri Datasheet - Page 47

• Manufacturer Part Number: saf-xc822t-1fri
• Description: 8-bit Single-chip Microcontroller
• Manufacturer: Infineon Technologies Corporation

Preliminary
4
Chapter 4
4.1
Table 24
XC824 respectively.
Table 24
Parameter
Thermal resistance junction
case
Thermal resistance junction
lead
1) The thermal resistances between the case and the ambient (
Data Sheet
combined with the thermal resistances between the junction and the case (
(
(
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
the total thermal resistance between the junction and the ambient. This total junction ambient resistance
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
R
R
1)
TJL
TJA
1)
) given above, in order to calculate the total thermal resistance between the junction and the ambient
). The thermal resistances between the case and the ambient (
provides the thermal characteristics of the packages used in XC822 and
provides the information of the XC822/824 package and reliability section.
Package and Quality Declaration
Package Parameters
Thermal Characteristics of the Packages
Symbol
R
R
TJC
TJL
CC -
CC -
Min.
-
-
43
Limit Values
R
Max.
36.2
34.3
356.6
36.2
TCA
Package and Quality Declaration
) , the lead and the ambient (
R
TCA
T
Unit
K/W
K/W
K/W
K/W
), the lead and the ambient (
J
=
R
T
TJC
A
+
R
), the junction and the lead
TJA
Package Types
PG-TSSOP-16-1
PG-DSO-20-45
PG-TSSOP-16-1
PG-DSO-20-45
×
P
D
, where the
XC822/824
V0.1, 2010-02
R
TLA
) are to be
R
R
TJA
R
TLA
TJA
is
)