mc33184dtb ON Semiconductor, mc33184dtb Datasheet - Page 11
mc33184dtb
Manufacturer Part Number
mc33184dtb
Description
Low Power, High Slew Rate, Wide Bandwidth, Jfet Input Operational Amplifiers
Manufacturer
ON Semiconductor
Datasheet
1.MC33184DTB.pdf
(12 pages)
MOTOROLA ANALOG IC DEVICE DATA
SEATING
PLANE
–T–
14
H
1
14
1
G
–A–
D
G
14 PL
A
F
0.25 (0.010)
7
8
M
8
7
D
–B–
T
N
SEATING
PLANE
K
B
OUTLINE DIMENSIONS – continued
B
S
C
P
MC34181,2,4 MC33181,2,4
C
7 PL
A
K
S
0.25 (0.010)
R
PLASTIC PACKAGE
PLASTIC PACKAGE
X 45
CASE 751A–03
L
CASE 646–06
M
_
M
J
D SUFFIX
P SUFFIX
M
ISSUE F
ISSUE L
(SO–14)
B
M
J
F
NOTES:
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD
4. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
FORMED PARALLEL.
FLASH.
DIM
G
M
DIM
A
B
C
D
F
J
K
P
R
A
B
C
D
G
H
K
M
N
F
J
L
MILLIMETERS
MIN
0.715
0.240
0.145
0.015
0.040
0.052
0.008
0.115
0.015
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
MIN
1.27 BSC
0
0.100 BSC
0.300 BSC
0
_
INCHES
_
MAX
0.770
0.260
0.185
0.021
0.070
0.095
0.015
0.135
0.039
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
MAX
7
10
_
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
18.16
MIN
MILLIMETERS
MIN
6.10
3.69
0.38
1.02
1.32
0.20
2.92
0.39
0.050 BSC
0
INCHES
2.54 BSC
7.62 BSC
_
0
_
MAX
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
19.56
6.60
4.69
0.53
1.78
2.41
0.38
3.43
1.01
7
10
_
_
11