mpc755ed Freescale Semiconductor, Inc, mpc755ed Datasheet - Page 8
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mpc755ed
Manufacturer Part Number
mpc755ed
Description
Risc Microprocessor Hardware Specifications
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MPC755ED.pdf
(56 pages)
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Electrical and Thermal Characteristics
Table 3
Table 4
initially sampled in a CBGA package, but production units are currently provided in both a CBGA and a
PBGA package. Because of the better long-term device-to-board interconnect reliability of the PBGA
package, Freescale recommends use of a PBGA package except where circumstances dictate use of a
CBGA package. The MPC745 is offered in a PBGA package only.
8
Core supply voltage
PLL supply voltage
L2 DLL supply voltage
Processor bus supply
voltage
L2 bus supply voltage
Input voltage
Die-junction temperature
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support. For more information, refer to
3. 2.0 V nominal.
4. 2.5 V nominal.
5. 3.3 V nominal.
guaranteed.
Numbers Not Fully Addressed by This Document.”
provides the recommended operating conditions for the MPC755.
provides the package thermal characteristics for the MPC755 and MPC745. The MPC755 was
Characteristic
BVSEL = 1
L2VSEL = 1
Processor bus
L2 bus
JTAG signals
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Table 3. Recommended Operating Conditions
Symbol
L2OV
L2AV
AV
OV
V
V
V
V
T
DD
in
in
in
DD
DD
j
DD
DD
300 MHz, 350 MHz
2.375
3.135
2.375
3.135
GND
GND
GND
1.80
1.80
1.80
Min
0
Recommended Value
L2OV
2.625
3.465
2.625
3.465
OV
OV
Max
2.10
2.10
2.10
105
DD
DD
DD
2.375
3.135
2.375
3.135
GND
GND
GND
1.90
1.90
1.90
Min
0
1
400 MHz
L2OV
2.625
3.465
2.625
3.465
OV
OV
Max
2.10
2.10
2.10
105
Freescale Semiconductor
DD
DD
DD
Section 10.2, “Part
Unit
°C
V
V
V
V
V
V
V
V
Notes
2, 4
2, 4
3
3
3
5
5
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