at84ad001b ATMEL Corporation, at84ad001b Datasheet - Page 57

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at84ad001b

Manufacturer Part Number
at84ad001b
Description
Dual 8-bit 1 Gsps Adc
Manufacturer
ATMEL Corporation
Datasheet

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Thermal Resistance from
Junction to Ambient
Thermal Resistance from
Junction to Board
2153C–BDC–04/04
The thermal resistance from the junction to ambient is 25.2° C/W typical.
Note:
The thermal resistance from the junction to the board is 13° C/W typical.
In order to keep the ambient temperature of the die within the specified limits of the
device grade (that is T
and the die junction temperature below the maximum allowed junction temperature of
105°C, it is necessary to operate the dual ADC in air flow conditions (1m/s recom-
mended).
In still air conditions, the junction temperature is indeed greater than the maximum
allowed T
- T
- T
J
J
= 25.2°C/W x 1.4W + T
= 25.2°C/W x 1.4W + T
J
.
A
max = 70°C in commercial grade and 85°C in industrial grade)
A
A
= 35.28 + 70 = 105.28°C for commercial grade devices
= 35.28 + 85 = 125.28°C for industrial grade devices
57

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