hi1-0303-883 Intersil Corporation, hi1-0303-883 Datasheet - Page 10

• Manufacturer Part Number: hi1-0303-883
• Description: Dual Spdt Cmos Analog Switch
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
Metallization Mask Layout
76 mils x 83.9 mils x 19 mils
Type: Aluminum
Thickness: 16k
Type: Nitride
Thickness: 7k
Å
Å
±0.7k
±2k
Å
Å
10
V+
S
S
4
3
13
14
2
D
12
D
4
3
3
HI-303/883
HI-303/883
D
D
11
4
2
1
DIE ATTACH:
WORST CASE CURRENT DENSITY:
S
10
S
Material: Gold/Silicon Eutectic Alloy
Temperature: Ceramic DIP - 460°C (Max)
3.9 x 10
This device meets Glassivation Integrity Test requirement
per MIL-STD-883 Method 2021 and MIL-M-38510 para-
graph 3.5.5.4
5
2
1
5
A/cm
IN
IN
9
6
2
1
2
at 30mA
7
8
GND
V-