se5503a Skyworks Solutions, Inc., se5503a Datasheet - Page 12

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se5503a

Manufacturer Part Number
se5503a
Description
Dual Band 802.11a/b/g/n Wireless Lan Front End
Manufacturer
Skyworks Solutions, Inc.
Datasheet

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Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE5503A is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended by SiGe, please refer to:
Product Branding
DST-00320 ƒ Rev 1.7 ƒ Feb-9-2011
ƒ
ƒ
SiGe’s Application Note: “Land Grid Array Module Solder Reflow & Rework Information”, Document Number
QAD-00046.
SiGe’s Application Note: “Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document
Number QAD-00047.
Caution! Class 1A ESD sensitive device
Figure 7: SE5503A Branding Information
Confidential
Dual Band 802.11a/b/g/n Wireless LAN Front End
5503A
Preliminary Information
SE5503A
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