74hct2g66 NXP Semiconductors, 74hct2g66 Datasheet - Page 18
74hct2g66
Manufacturer Part Number
74hct2g66
Description
Bilateral Switches
Manufacturer
NXP Semiconductors
Datasheet
1.74HCT2G66.pdf
(20 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
74hct2g66DP
Manufacturer:
NXP
Quantity:
2 933
Company:
Part Number:
74hct2g66DP,125
Manufacturer:
NXP Semiconductors
Quantity:
4 750
Company:
Part Number:
74hct2g66GD
Manufacturer:
NXP
Quantity:
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Company:
Part Number:
74hct2g66GD,125
Manufacturer:
NXP
Quantity:
2 635
Philips Semiconductors
PACKAGE OUTLINE
2004 May 19
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
Bilateral switches
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT505-2
max.
1.1
A
0.15
0.00
A 1
8
1
0.95
0.75
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.38
0.22
b p
b p
5
0
0.18
0.08
4
JEDEC
c
- - -
w
REFERENCES
D
3.1
2.9
M
(1)
E
3.1
2.9
(1)
c
JEITA
scale
0.65
18
2.5
e
A
H E
4.1
3.9
A 2
A 1
0.5
L
H E
E
5 mm
0.47
0.33
detail X
L p
74HC2G66; 74HCT2G66
0.2
v
L
L p
PROJECTION
EUROPEAN
0.13
w
A
(A 3 )
0.1
y
X
v
M
Product specification
0.70
0.35
Z
A
(1)
ISSUE DATE
02-01-16
8
0
SOT505-2