max9977 Maxim Integrated Products, Inc., max9977 Datasheet - Page 16

• Manufacturer Part Number: max9977
• Description: Max9977 Quad, Low-power, 1200mbps Ate Driver
• Manufacturer: Maxim Integrated Products, Inc.

Quad, Low-Power, 1200Mbps
ATE Driver
Figure 4. Serial-Interface Timing
for making IDDQ and PMU measurements without the
need for an output disconnect relay. LLEAK is pro-
grammed independently for each channel.
When DUT_ is driven with a high-speed signal while
LLEAK is asserted, the leakage current momentarily
increases beyond the limits specified for normal opera-
tion. The low-leakage recovery specification in the
Electrical Characteristics table indicates device behav-
ior under this condition.
The ground-sense input, GS, provides a ground refer-
ence for the mux inputs. Connect GS to the ground of
the DAC circuits driving DHV_, DTV_, and DLV_.
To maintain an 8V range in the presence of GS variations,
GS offsets DHV_, DLV_, and DTV_ ranges. Adequate
supply headroom must be maintained in the presence of
GS variations. Ensure:
The MAX9977 supplies a temperature output signal,
TEMP, that asserts a 3.33V nominal output voltage at a
+70°C (343K) die temperature. The output voltage
changes proportionally with temperature at 10mV/°C.
16
SCLK
DIN
CS
______________________________________________________________________________________
V
V
t
CH
CC
EE
t
≤ -4.5V + Min (V
CSS0
≥ 9.5V + Max (V
Temperature Monitor
D7
t
DS
D6
t
GS
DH
GS
)
)
GS Input
D5
t
CL
D4
Under normal circumstances, the MAX9977 requires
heat removal through the exposed pad by use of an
external heat sink. The exposed pad is electrically at V
potential, and must be either connected to V
ed.
θ
1°C/W to 2°C/W. Die temperature is thus highly depen-
dent upon the heat removal techniques used in the
application. Maximum total power dissipation occurs
under the following conditions:
• V
• V
• V
• Short-circuit current = 60mA
Under these extreme conditions, the total power dissi-
pation is 5.8W. If the die temperature cannot be main-
tained at an acceptable level under these conditions,
use software clamping to limit the load output currents
to lower values and/or reduce the supply voltages.
Bypass all V
capacitors, and use bulk bypassing of at least 10µF on
each supply.
JC
D3
CC
EE
DHV_
of the exposed-pad package is approximately
= -5.25V
= +10.5V
= 6.5V, DATA = HIGH
Power-Supply Considerations
D2
CC
and V
D1
EE
t
CSH1
power input pins with 0.01µF
D0
Heat Removal
t
CSS1
t
CSWH
EE
or isolat-
EE