max97200 Maxim Integrated Products, Inc., max97200 Datasheet - Page 2

• Manufacturer Part Number: max97200
• Description: Low-power, Low-offset, Dual Mode, Class H Directdrive Headphone Amplifier
• Manufacturer: Maxim Integrated Products, Inc.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Low-Power, Low-Offset, Dual Mode, Class H
DirectDrive Headphone Amplifier
ABSOLUTE MAXIMUM RATINGS
PVIN or PVDD to PGND .......................................-0.3V to +2.2V
GND to PGND ......................................................-0.3V to +0.3V
PVSS to PGND .....................................................-2.2V to +0.3V
OUT_ and IN_ to GND ............. (PVSS - 0.2V) to (PVDD + 0.2V)
C1P, C1N ...................................................Cap connection only
SHDN to GND .........................................................-0.3V to +4V
Output Short-Circuit Current .....................................Continuous
Thermal Limits (Note 1)
ELECTRICAL CHARACTERISTICS
(V
Typical values are at T
2
POWER SUPPLY
Supply Voltage Range
UVLO Rising
UVLO Falling
Quiescent Supply Current
Shutdown Current
Turn-On Time
CHARGE PUMP
Oscillator Frequency
Oscillator Frequency
Oscillator Frequency
Positive Output Voltage
Negative Output Voltage
Output Voltage Threshold
Output Voltage Threshold
PVIN
Multiple Layer PCB
______________________________________________________________________________________
= 1.8V, V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
PGND
A
= V
= +25NC.) (Note 2)
GND
= 0V, V
SYMBOL
V
V
I
f
f
f
SHDN
PVIN
V
V
SHDN
OSC1
OSC2
OSC3
PVDD
I
t
PVSS
DD
ON
TH1
TH2
= 1.8V, C1 = C2 = C3 = 1FF, C4 = 10FF, T
Guaranteed by PSRR
Inputs grounded, T
16I load, inputs grounded, T
V
V
V
V
V
V
V
V
R
charge pump switches modes, V
rising, transition from 1/8 to normal
frequency
R
charge pump switches modes, V
rising, transition from high-efficiency
mode to high-power mode
SHDN
OUT
OUT
OUT
OUT
OUT
OUT
OUT
L
L
= J, output voltage at which the
= J, output voltage at which the
= 0V, T
= 0.2V, R
= 0.5V, R
= 0.2V, R
= 0.5V, R
= 0.2V, R
= 0.5V, R
= 0V, T
A
CONDITIONS
A
= +25NC
L
L
L
L
L
L
= +25NC
= J, f
= J, f
= J
= J
= J
= J
Junction Temperature .....................................................+150NC
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Bump Temperature (soldering) Reflow ...........................+230NC
A
= +25NC, no load
Continuous Power Dissipation (T
12-Bump WLP (derate 13.7mW/NC above +70NC) ....1095mW
12-Bump WLP B
12-Bump WLP B
IN
IN
= 1kHz
= 1kHz
A
= +25NC
OUT
OUT
JA
CA
A
.......................................................73NC/W
......................................................30NC/W
= T
MIN
1.62
1.36
MIN
78
to T
MAX
A
-PVIN/2
PVIN/2
QPVIN
QPVIN
-PVIN
PVIN
= +70NC)
TYP
1.80
1.48
1.46
1.15
1.16
0.08
0.24
665
500
0.2
, unless otherwise noted.
83
.6
x
x
MAX
1.98
1.58
1.7
88
1
UNITS
kHz
kHz
kHz
mA
ms
FA
V
V
V
V
V
V
V