lmv1015xrx-25 National Semiconductor Corporation, lmv1015xrx-25 Datasheet
lmv1015xrx-25
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lmv1015xrx-25 Summary of contents
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... ECM canisters and thicker. These extremely miniature packages have the Large Dome Bump (LDB) technology. This micro SMD technology is designed for microphone PCBs requiring 1 kg adhesion criteria. Schematic Diagram © 2005 National Semiconductor Corporation Features (Typical LMV1015-15, 2.2V supply unless otherwise specified) ...
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Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance (Note 2) Human Body Model Machine Model Supply Voltage V - GND DD Storage Temperature Range 2.2V ...
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Electrical Characteristics Unless otherwise specified, all limits guaranteed for T Boldface limits apply at the temperature extremes. Symbol Parameter SNR Signal to Noise Ratio V Max Input Signal IN V Output Voltage OUT f Lower −3dB Roll Off Frequency ...
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... Package Part Number LMV1015XR-15 4-Bump Extreme Thin LMV1015XRX-15 micro SMD (0.3 mm max height) LMV1015XR-25 lead free only LMV1015XRX-25 4-Bump Ultra-Thin LMV1015UR-15 micro SMD LMV1015URX-15 (0.4 mm max height) LMV1015UR-25 lead free only LMV1015URX-25 Note: All packages are supplied with large dome bump technology for 1kg adhesion criteria. ...
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Typical Performance Characteristics C = 2.2 µF, single supply 25˚C A Supply Current vs. Supply Voltage (LMV1015-15) Gain and Phase vs. Frequency (LMV1015-15) Total Harmonic Distortion vs. Frequency (LMV1015-15) Unless otherwise specified, V Supply Current vs. Supply Voltage ...
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Typical Performance Characteristics C = 2.2 µF, single supply 25˚C (Continued) A Total Harmonic Distortion vs. Input Voltage (LMV1015-15) Output Noise vs. Frequency (LMV1015-15) www.national.com Unless otherwise specified, V Total Harmonic Distortion vs. Input Voltage 20128907 Output Noise ...
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Application Section HIGH GAIN The LMV1015 series provides outstanding gain versus the JFET and still maintains the same ease of implementation, with improved gain, linearity and temperature stability. A high gain eliminates the need for extra external components. BUILT IN ...
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Application Section (Continued) SPL needs to be converted to the absolute sound pressure in dBPa. This is the sound pressure level in decibels referred to 1 Pascal (Pa). The conversion is given by: dBPa = dB SPL + 20*log 20 ...
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Application Section (Continued) FIGURE 6. RF Noise Reduction 9 20128908 www.national.com ...
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Physical Dimensions NOTE: UNLESS OTHERWISE SPECIFIED. 1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 3. PIN A1 IS ESTABLISHED BY LOWER LEFT ...
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information ...