ltc3586 Linear Technology Corporation, ltc3586 Datasheet - Page 35

• Manufacturer Part Number: ltc3586
• Description: High Ef? Ciency Usb Power Manager With Boost, Buck-boost And Dual Bucks
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTION
6.00 ± 0.10
4.50 ± 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
3.10 ± 0.05
PIN 1
TOP MARK
(NOTE 6)
4.00 ± 0.10
2.40 REF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
(Reference LTC DWG # 05-08-1712 Rev B)
2.65 ± 0.05
38-Lead Plastic QFN (4mm × 6mm)
4.65 ± 0.05
0.40 BSC
0.20 ±0.05
0.75 ± 0.05
UFE Package
5.10 ± 0.05
6.50 ± 0.05
4.40 REF
0.200 REF
0.00 – 0.05
4.40 REF
R = 0.10
TYP
R = 0.115
TYP
0.70 ±0.05
BOTTOM VIEW—EXPOSED PAD
4.65 ± 0.10
PACKAGE OUTLINE
2.65 ± 0.10
2.40 REF
37
38
0.40 BSC
0.20 ± 0.05
PIN 1 NOTCH
R = 0.30 OR
0.35 × 45°
CHAMFER
(UFE38) QFN 0707 REV A
1
2
0.40 ± 0.10
LTC3586
35
3586f