ltc3566 Linear Technology Corporation, ltc3566 Datasheet - Page 27

• Manufacturer Part Number: ltc3566
• Description: High Ef?ciency Usb Power Manager Plus 1a Buck-boost Converter
• Manufacturer: Linear Technology Corporation

TYPICAL APPLICATIONS
PACKAGE DESCRIPTION
05
5 0.05
SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.05
4.5V TO 5.5V
USB
PARTS LIST
C1: MURATA GRM21BR61A/06KE19
C2,C3: TAIYO-YUDEN JMK212BJ226MG
L1: COILCRAFT LPS4018-332MLC
L2: COILCRAFT LPS4018-222MLC
100k
C1
10μF
Direct Pin Controlled LTC3566 USB Power Manager with 3.3V/1A Buck-Boost
0.50 BSC
T
100k
0.25 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.70 0.05
PACKAGE
OUTLINE
2k
CONTROLLER
TO DIGITAL
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
ON THE TOP AND BOTTOM OF PACKAGE
0.1μF
PIN 1
TOP MARK
(NOTE 6)
(Reference LTC DWG # 05-08-1697 Rev B)
24-Lead Plastic QFN (4mm × 4mm)
3.01k
1μF
4.00 0.10
(4 SIDES)
V
NTC
PROG
CLPROG
LDO3V3
CHRGEN
MODE
BUS
EN1
UF Package
2
LTC3566
GND
0.75 0.05
SWCD1
SWAB1
ILIM
V
CHRG
GATE
V
OUT1
GND
V
BAT
OUT
FB1
V
SW
IN1
C1
2.45 0.10
0.200 REF
0.00 – 0.05
(4-SIDES)
3.3μH
330pF
L2
2.2μH
10pF
L1
121k
324k
15k
+
OPTIONAL
2.2μF
R = 0.115
Li-Ion
BOTTOM VIEW—EXPOSED PAD
33pF
TYP
105k
1k
23
24
C2
22μF
C3
22μF
3566 TA02
0.50 BSC
0.25 0.05
1
2
(UF24) QFN 0105
LTC3566
0.40 0.10
TO
OTHER
LOADS
3.3V/1A
DISK DRIVE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 45 CHAMFER
27
3566p