bus-20-061 FCI connector, bus-20-061 Datasheet - Page 3

• Manufacturer Part Number: bus-20-061
• Description: Metral Board Connectors For Pin-in-paste Processes
• Manufacturer: FCI connector

Board connectors for Pin-in-Paste processes
GENERAL INFORMATION
Application Design Guidelines
For application in a Pin-in-Paste process, FCI recommends the application design guidelines below.
Description
The METRAL
ardized 2 mm backplane interconnect system complying
with IEC 61076-4-104 that provides options to support
low and high speed signaling applications.
It features 4, 5 or 8 row of contacts with up to 5 mating
levels with stackable modules that provides flexibility
in integrating signal, power and coaxial connections at
backplane interface.
Pin-in-Paste
Pin-in-paste (PiP) technology allows the use of TMT
products in SMT manufacturing processes.
The connectors are automatically or manually placed on
the board , then soldered in the same operations as the
SMT components. Despite this, the mechanical strength
of the TMT soldering is maintained. This is an important
requirement for connectors nowadays in many indus-
trial or automotive applications.
Connector Design
In order to achieve compatibility with an automatic
pick&place equipment, vision systems and
reflow soldering processes connectors are adapted
meeting specific requirements like housing design,
holding features, plastic material and packaging.
METRAL
ture resistant LCP.
Stencil Design
The stencil design is crucial for a good solder joint.
It determines the quality of paste and the position of the
paste print on the board. each PCB hole has its own
stencil aperture with enough spacing in between in order
to have seperate solder deposits.
This prevents solder robbing from one hole to another
and guarantees the correct quantity of solder paste for
each hole. The print position is slightly asymmetrical so
as to optimise the flow of molten solder paste.
Paste Application
The quantity of paste for each hole depends on the
soldering process parameters and the degree of hole
filling. For the squeegee, FCI recommends a 45
You can use a smaller angle for an even greater degree
of hole filling. The squeegee moves in parallel with the
shorter sides of the stencil apertures.
Board Layout
The recommended finished hole diameter for METRAL
PiP product on daughtercards is between 0.65mm and
0.80mm. For automatic pick-and-place, lean towards the
upper end of the tolerance
®
PiP products are moulded in high tempera-
®
modular interconnect system is a stand-
0
angle.
www.fci.com/metral
®
COMPONENT ASSEMBLED
FINISHED PLATED HOLE
1
4
Housing Design
Standoffs raise the housing body slightly above the PCB
surface and thus allow the molten solder paste to flow
freely from its printed position into the board hole and
around the pin. The standoffs are correctly positioned
for a good solder paste deposit around the pin.
Please respect the stencil design guidelines below in
order to avoid paste deposits around the standoffs.
Pin Length
FCI uses a solder tail length of 2.9mm +/-0.2mm for
METRAL
of 1.6 mm thickness nominal.
Packaging
For combining SMT and TMT components not only in
the soldering process, but also in the assembly process,
FCI proposes a choice of pick-and-place packaging for
PIP connectors. The most common part numbers are
available in tape-on-reel packaging, all others in tube.
3
®
and SOFIX
SOLDER PASTE
®
STENCIL
Headers for a standard PCB
SQUEEGEE
REFLOW SOLDERED
SOLDER PASTE
2
5
3