mcm63d736 Freescale Semiconductor, Inc, mcm63d736 Datasheet - Page 13

• Manufacturer Part Number: mcm63d736
• Description: 128k X 36 Bit Synchronous Dual I/o, Dual Address Sram
• Manufacturer: Freescale Semiconductor, Inc

SEATING
PLANE
–H–
–T–
–L–
PIN 1
IDENT
C L
44
C
1
4X
176
45
0.20
S1
C2
H
A1
C1
L–M N
W
0.05
Freescale Semiconductor, Inc.
C L
S
VIEW AA
For More Information On This Product,
S
A
–N–
Z
E
K
4X
4X 44 TIPS
q
q
1
Go to: www.freescale.com
2
PACKAGE DIMENSIONS
133
88
2X R
GAGE
PLANE
132
TQFP PACKAGE
89
R1
0.25
CASE 1101–01
0.20
3X
q
176–LEAD
VIEW AA
VIEW Y
B1
–M–
T
L–M N
0.08
V1
B
T
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS
4. DATUMS –L–, –M–, AND –N– TO BE DETERMINED AT DATUM PLANE
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
COINCIDENT WITH THE LEAD WHERE THE THE LEAD EXITS THE
PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.
–H–.
ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A
AND B DO INLCUDE MOLD MISMATCH AND ARE DETERMINED AT
DATUM PLANE –H–.
PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.35
(0.014) MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT
LEAD 0.07 (0.003).
PLATING
C L
DIM
A1
B1
C1
C2
R1
S1
V1
q
q
G
W
A
B
C
D
E
F
J
K
P
S
U
V
Z
q
1
2
AB
AB
U
MILLIMETERS
MIN
0.05
1.35
0.17
0.45
0.17
0.09
0.10
0.09
–––
24.00 BSC
12.00 BSC
24.00 BSC
12.00 BSC
26.00 BSC
13.00 BSC
26.00 BSC
13.00 BSC
ROTATED 90 CLOCKWISE
0.50 BSC
0.50 REF
0.25 BSC
0.20 REF
1,00 REF
0
0
12 REF
_
_
SECTION AB–AB
_
0.08
É É É É
Ç Ç Ç
É É É É
Ç Ç Ç
É É É É
Ç Ç Ç
MAX
1.60
1.45
0.23
0.75
0.27
0.20
0.20
0.16
–––
–––
7
VIEW Y
_
M
F
D
_
T
L–M
X=L, M, N
G
–X–
S
P
N
BASE
METAL
J
S
MCM63D736
13