n02l1618c1a-ds AMI Semiconductor, Inc., n02l1618c1a-ds Datasheet

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n02l1618c1a-ds

Manufacturer Part Number
n02l1618c1a-ds
Description
2mb Ultra-low Power Asynchronous Cmos Sram
Manufacturer
AMI Semiconductor, Inc.
Datasheet
The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com.
2Mb Ultra-Low Power Asynchronous CMOS SRAM
128Kx16 bit
Overview
The N02L1618C1A is an integrated memory
device containing a 2 Mbit Static Random Access
Memory organized as 131,072 words by 16 bits.
The device is designed and fabricated using AMI
Semiconductor’s advanced CMOS technology to
provide both high-speed performance and ultra-low
power. The base design is the same as AMI’s
N02L163WN1A, which is processed to operate at
higher voltages. The device operates with a single
chip enable (CE) control and output enable (OE) to
allow for easy memory expansion. Byte controls
(UB and LB) allow the upper and lower bytes to be
accessed independently. The N02L1618C1A is
optimal for various applications where low-power is
critical such as battery backup and hand-held
devices. The device can operate over a very wide
temperature range of -40
available in JEDEC standard packages compatible
with other standard 128Kb x 16 SRAMs.
Product Family
N02L1618C1AB2 Green 48-BGA
N02L1618C1AT2 Green 44-TSOP2
N02L1618C1AB
N02L1618C1AT
Part Number
Package Type
44 - TSOP2
48 - BGA
o
C to +85
AMI Semiconductor, Inc.
ULP Memory Solutions
670 North McCarthy Blvd. Suite 220
Milpitas, CA 95035
PH: 408-935-7777, FAX: 408-935-7770
-40
o
Temperature
C and is
Operating
(DOC# 14-02-012 REV C ECN# 01-1274)
o
C to +85
o
C 1.65V - 2.2V
Supply
Power
(Vcc)
Features
• Single Wide Power Supply Range
• Very low standby current
• Very low operating current
• Very low Page Mode operating current
• Simple memory control
• Low voltage data retention
• Very fast output enable access time
• Automatic power down to standby mode
• TTL compatible three-state output driver
• Compact space saving BGA package avail-
1.65 to 2.2 Volts
0.5µA at 1.8V (Typical)
1.4mA at 1.8V and 1µs (Typical)
0.5mA at 1.8V and 1µs (Typical)
Single Chip Enable (CE)
Byte control for independent byte operation
Output Enable (OE) for memory expansion
Vcc = 1.2V
30ns OE access time
able
RoHS Compliant
70 and 85ns
@ 1.65V
Speed
N02L1618C1A
Current (I
Standby
10 µA
Max
SB
),
3 mA @ 1MHz
Current (Icc),
Operating
Max
1

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n02l1618c1a-ds Summary of contents

Page 1

... PH: 408-935-7777, FAX: 408-935-7770 2Mb Ultra-Low Power Asynchronous CMOS SRAM 128Kx16 bit Overview The N02L1618C1A is an integrated memory device containing a 2 Mbit Static Random Access Memory organized as 131,072 words by 16 bits. The device is designed and fabricated using AMI Semiconductor’s advanced CMOS technology to provide both high-speed performance and ultra-low power. The base design is the same as AMI’ ...

Page 2

... G I Pin BGA (top (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A I I ...

Page 3

... When LB only is in the select mode only I I/O are affected as shown Symbol Test Condition 0V MHz 0V MHz, T I/O IN (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A Input/ Output I/O - I/O Mux 0 and Buffers I/O - I/O 8 MODE POWER 2 Standby Standby 2 Standby Standby ...

Page 4

... C, VCC = 2 1.2V Chip Disabled =25°C and are not 100% tested. A (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A Rating Unit –0 +0 –0.3 to 3.0 V 500 mW o –40 to 125 C o - 10sec(Lead only) ...

Page 5

... SRAMs. The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com Open page ... Word 1 Word 2 (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A Word 16 5 ...

Page 6

... LBW UBW WHZ (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A 0. 5ns 0 30pF 1.65 - 2.2V o -40 to +85 C 70ns Units Min. Max ...

Page 7

... The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com OLZ LBLZ, UBLZ (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A Data Valid OHZ t t LBHZ, UBHZ Data Valid 7 ...

Page 8

... The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com LBW UBW WHZ LBW UBW WHZ (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A Data Valid t OW High Data Valid High-Z 8 ...

Page 9

... DETAIL B 0.20 0.00 Note: 1. All dimensions in inches (Millimeters) 2. Package dimensions exclude molding flash The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com. 18.41±0.13 11.76±0.20 0.45 0.30 1.10±0.15 0.80mm REF (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A SEE DETAIL ...

Page 10

... PRIMARY DATUM Z AND SEATING PLANE ARE DEFINED BY THE e SPHERICAL CROWNS OF THE SOLDER BALLS BALL PAD CORNER I. MARKED BY INK 0.75 BALL MATRIX TYPE 0.375 1.125 1.375 FULL (DOC# 14-02-012 REV C ECN# 01-1274) N02L1618C1A 1. 0.35±0.05 DIA. 2. SEATING PLANE - Z 0. ...

Page 11

... AMI Semiconductor, Inc. Ordering Information N02L1618C1AX-XX X Revision History Revision # Date A Apr. 2003 B Nov. 2005 C September 2006 © 2006 AMI Semiconductor, Inc. All rights reserved. AMI Semiconductor, Inc. ("AMIS") reserves the right to change or modify the information contained in this data sheet and the products described therein, without prior notice. ...

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