ltc1923euh-trpbf Linear Technology Corporation, ltc1923euh-trpbf Datasheet - Page 28

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ltc1923euh-trpbf

Manufacturer Part Number
ltc1923euh-trpbf
Description
High Efficiency Thermoelectric Cooler Controller
Manufacturer
Linear Technology Corporation
Datasheet
PACKAGE DESCRIPTIO
RELATED PARTS
PART NUMBER
LTC1658
LTC1693-1
LTC2053
LTC1923
28
5.35 0.05
4.20 0.05
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
3.45 0.05
(4 SIDES)
DESCRIPTION
14-Bit Rail-to-Rail Micropower DAC
High Speed Dual N-Channel MOSFET Driver
Zero Drift Instrumentation Amp
NOTE:
1. DRAWING PROPOSED TO INCLUDE JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
5.00 0.10
(4 SIDES)
U
www.linear.com
32-Lead Plastic QFN (5mm 5mm)
0.50 BSC
0.23 0.05
(Reference LTC DWG # 05-08-1693)
UH Package
0.57 0.05
COMMENTS
3V or 5V Single Supply Operation, I
8-Lead MSOP Package
1.5A Peak Output Current, 1G Electrical Isolation, SO-8 Package
Max Gain Error 0.01%, Input Offset Drift of 50nV/ C, Input Offset Voltage of 10 V
PACKAGE OUTLINE
0.75 0.05
3.45 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
CC
= 270 A,
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
LINEAR TECHNOLOGY CORPORATION 2001
LT/TP 0502 2K • PRINTED IN USA
31
0.50 BSC
0.23 0.05
32
0.40 0.10
1
2
(UH) QFN 0102
1923f

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