S25FL016A Meet Spansion Inc., S25FL016A Datasheet - Page 35

• Manufacturer Part Number: S25FL016A
• Description: 16 Megabit Cmos 3.0 Volt Flash Memory With 50 Mhz Spi Bus Interface
• Manufacturer: Meet Spansion Inc.

18. Revision History
January 7, 2008 S25FL016A_00_C3
Revision A (July 13, 2004)
Global
Revision A1 (September 13, 2004)
Connection Diagrams
Ordering Information Table
Revision A2 (December 16, 2004)
Read Identification (RDID)
Revision A3 (March 3, 2005)
Ordering Information
Read Identification (RDID)
Revision A4 (March 29, 2005)
DC Characteristics
Global
Revision A5 (June 21, 2005)
Distinctive Characteristics
Ordering Information
Valid Combination Table
Power-up and Power-down section
DC Characteristics
AC Characteristics
Revision A6 (December 21, 2005)
Global
Ordering Information
Valid Combination Table
Revision B0 (April 18, 2005)
Global
AC Characteristics table
Revision B1 (June 29, 2006)
DC Characteristics
Revision C0 (August 28, 2006)
Global
Revision C1 (February 16, 2007)
Global
Absolute Maximum Ratings
Revision C2 (June 29, 2007)
Device Operations
Revision C3 (January 7, 2008)
Ordering Information
Section
Initial release.
Added the WSON 6x8mm pin out.
Changed OPN to reflect Device technology identification change from M to A for CS99S MirrorBit
technology.
Changed memory capacity of the device in the second byte from 14h to 15h.
Added new commercial temperature range. Updated package and temperature, and package
marking information. Added note on standard package A and Pb-free package F information.
Updated memory capacity of the device in the second byte from 15h to 14h.
Updated table.
Removed Commercial temperature range.
Updated Page Program speed. Update Deep Power Down Mode time. Update timing numbers.
Added Tray to packing type.
Updated Packing Type.
Updated this section. Removed Figure 19. Updated Table 7 Power-up Timing.
Added and updated values in Table 8.
Updated Figure 21.
Added 8-pin SO package to Distinctive Characteristics, Connection Diagram, and Ordering
Information, and Physical Dimensions sections.
Added Tray to packing type.
Updated.
Changed document status from Advance Information to Preliminary. Changed title from family of
devices to specific device.
Updated t
Changed typical and maximum specifications for I
Rewrote entire document for better flow and clarity. No specifications were changed.
Deleted Preliminary status from document.
Added overshoot and undershoot information.
Added sentence to Byte or Page Programming
Added Tray packing option for 8-pin and 16-pin SOIC packages.
D a t a
W
specifications.
S h e e t
S25FL016A
Description
CC2
.
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