tlp358 TOSHIBA Semiconductor CORPORATION, tlp358 Datasheet - Page 6

• Manufacturer Part Number: tlp358
• Description: Toshiba Photocoupler Gaa?as Ired Led + Photo Ic
• Manufacturer: TOSHIBA Semiconductor CORPORATION

Soldering and Storage
(1) Precautions for Soldering
1) When Using Soldering Reflow
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
An example of a temperature profile when Sn-Pb eutectic solder is used:
Apply preheating of 150 deg.C for 60 to 120 seconds.
Mounting condition of 260 deg.C or less within 10 seconds is recommended.
Flow soldering must be performed once
Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds
Heating by soldering iron must be only once per 1 lead
An example of a temperature profile when lead(Pb)-free solder is used:
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
not exceeding 350 deg.C.
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TLP358/TLP358F
2009-08-10