efm32g890 ETC-unknow, efm32g890 Datasheet - Page 57

• Manufacturer Part Number: efm32g890
• Description: Ic Microcontroller
• Manufacturer: ETC-unknow

2010-12-17 - d0010_Rev1.20
1. All dimensions are in millimeters.
2. 'e' represents the basic solder ball grid pitch.
3. Dimension 'b' is measurable at the maximum ball diameter, parallel to primary datum 'C'.
4. Primary datum 'C' and seating plane are defined by the spherical crowns of the contact balls.
5. Dimension 'A' includes standoff height 'A1', package body thickness and lip height, but does not
6. Package dimensions take reference to JEDEC MO-275 rev. A.
Table 4.4. BGA112 (Dimensions in mm)
The BGA112 Package uses Sn96.5/Ag3/Cu0.5 solderballs.
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
include attach features.
Symbol
Nom
Max
Min
1.22
1.30
1.38
A
0.30
0.35
0.40
A1
0.42
0.47
0.52
b
10.00
D
10.00
E
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8.00
57
D1
8.00
E1
0.80
e
0.15
aaa
0.20
bbb
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0.12
ddd
0.15
eee
0.08
fff