rb520s FORMOSA MICROSEMI CO. LTD, rb520s Datasheet - Page 6

• Manufacturer Part Number: rb520s
• Description: Smd Schottky Barrier Diode
• Manufacturer: FORMOSA MICROSEMI CO. LTD

SOD-523FL
PACKAGE
Reel packing
Suggested thermal profiles for soldering processes
SMD Schottky Barrier Diode
RB520S
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
3.Flow (wave)soldering (solder dipping)
1.Storage environment: Temperature=10 ~35
2.Reflow soldering of surface-mount devices
REEL SIZE
7"
T
T
25
T
Average ramp-up rate(T
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
Tsmax to T
-Ramp-upRate
Time maintained above:
-Temperature(T
-Time(t
Peak Temperature(T
Time within 5 C of actual Peak
Temperature(t
Ramp-down Rate
Time 25
P
L
S
T
smin
T
REEL
(pcs)
3000
smax
L
)
Profile Feature
to Peak Temperature
L
COMPONENT
o
P
)
SPACING
L
)
(m/m)
4.0
Preheat
s
T
)
P
tt
t25
)
s
o
L
C
to T
to Peak
30,000 195*190*140
(pcs)
BOX
Ramp-up
Time
P
)
Page 6
(m/m)
INNER
BOX
Humidity=65%±15%
Ramp-down
tt
P
REEL
(m/m)
178
DIA,
Soldering Condition
tt
L
255 C-0/+5 C
60~150sec
<3 C/sec
60~120sec
<6 C/sec
360*355*227
400*300*410
450*395*420
<6minutes
10~30sec
<3 C/sec
CARTON
o
o
100 C
150 C
183 C
o
o
SIZE
(m/m)
o
o
o
Critical Zone
Document ID
DS-221674
Wave Soldering
IR Reflow
o
T
L
to
Formosa MS
CARTON
120,000
240,000
360,000
T
Issued Date
2008/02/10
(pcs)
P
Revised Date
-
GROSS WEIGHT
APPROX.
Revision
11.6
(kg)
4.3
7.8
A
Page.
7