ssc-mwt801-s Seoul Semiconductor, ssc-mwt801-s Datasheet - Page 6

• Manufacturer Part Number: ssc-mwt801-s
• Description: Device Led
• Manufacturer: Seoul Semiconductor

SSC-QP-0401-06 (REV.11)
6. Soldering Profile
(1) Reflow Soldering Conditions / Profile
(2) Lead-free solder
Soldering heat to be at maximum 260°C for maximum 10 seconds.
(3) Hand Soldering conditions
(4) The encapsulated material of the LEDs is silicone.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Preliminary heat to be at maximum 210ºC for maximum 2 minutes.
Soldering heat to be at maximum 240ºC for maximum 10 seconds.
Preliminary heating to be at maximum 220°C for maximum 2 minutes.
Not more than 5 seconds @MAX 300°C, under Soldering iron.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone
resign should be used.
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148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
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SEOUL SEMICONDUCTOR CO., LTD.
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Phone : [phone]~6
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Soldering Times [sec]
Soldering Times [sec]
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75
90 105 120 135 150 165 180 195
90
105 120 135 150 165 180 195
SSC-MWT801-S