tc1411n Microchip Technology Inc., tc1411n Datasheet - Page 10

• Manufacturer Part Number: tc1411n
• Description: 1a High-speed Mosfet Drivers
• Manufacturer: Microchip Technology Inc.

TC1411/TC1411N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
DS21390D-page 10
c
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MO-187
Drawing No. C04-111
p
B
See ASME Y14.5M
See ASME Y14.5M
n
β
F
Dimension Limits
E1
E
Units
A2
E1
A1
n
p
E
D
L
F
φ
B
α
A
c
β
MIN
.030
.000
.016
.003
.009
0°
5°
5°
-
L
.026 BSC
.193 BSC
.118 BSC
.118 BSC
.037 REF
2
1
Note:
INCHES
NOM
D
φ
.033
.024
.006
.012
-
-
-
-
-
8
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
MAX
A1
A
.043
.037
.006
.016
.009
.031
15°
15°
8°
MIN
0.75
0.00
0.40
0.08
0.22
© 2006 Microchip Technology Inc.
0°
5°
5°
-
MILLIMETERS*
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
Revised 07-21-05
0.85
0.60
α
-
-
-
-
-
-
-
8
MAX
1.10
0.95
0.15
0.80
0.23
0.40
A2
15°
15°
8°