sml080cwr5b-011 LEDtronics, Inc., sml080cwr5b-011 Datasheet - Page 5

• Manufacturer Part Number: sml080cwr5b-011
• Description: Hi-eff Red Axial Surface Mount Leds 2.1 .2 .7mm, Z-bend Leads 35 Viewing Angle
• Manufacturer: LEDtronics, Inc.

Manual of Soldering
The temperature of the iron tip should not be higher than 300°C (572°F) and soldering within 3 seconds per
solder-land is to be observed.
1. Soldering
2. Handling
3. Notes for designing
4. Storage:
JUDGEMENT CRITERIA OF FAILURE FOR THE RELIABILITY TEST
Note: 1. U means the upper limit of specific characteristics. S means initial value.
Part No.
RELIABILITY TEST
Care must be taken not to cause damage to the epoxy resin portion of LEDs while it is exposed to high
temperatures, or abrade the epoxy resin portion of LEDs with hard or sharp items as from sand blasting and
use of pointed objects.
Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the
rated figures. Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON
and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the
circuit should be designed so as to be subjected to reverse voltage when turning off the LEDs.
In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after
unpacking the sealed envelope.
If the envelope is still packed, store it in the following environment:
(1) Temperature: 5°C-30°C (41°F-86°F) Humidity: RH 60% Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent
soldering process must be:
(3) Devices require baking before mounting if: (2)a or (2)b is not met.
(4) If baking is required, devices must be baked under below conditions:
a. Completed within 24 hours.
b. Stored at less than 30% RH
Environmental
Test
Classification
Endurance
Test
Luminous intensity
Reflow Soldering
Preheating: 140°C~160°C ±5°C, within 2 minutes.
Operation heating: 235°C (Max.) within 10
seconds. (Max.)
Gradual Cooling (Avoid quenching).
Measuring items
Forward voltage
Reverse current
2. Measurement shall be taken between 2 hours and after the test pieces have been returned to
12 hours at 60°C ±3°C
normal ambient conditions after completion of each test.
140~160°C
Over 2 min.
SML080CWR5B-011
Operation
Life
High Temperature,
High Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Temperature
Cycling
Thermal Shock
Solder Resistance
235°C
Time
Test Item
4°C/sec. Max.
4°C/sec.
Max.
Ι (mcd)
Symbol
10 sec.
Max.
Ι (uA)
V (V)
v
r
f
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021:
MIL-STD-202: 103B
JIS C 7021:
MIL-STD-883: 1008
JIS C 7021:
JIS C 7021:
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1010
JIS C 7021:
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
MIL-STD-202: 201A
MIL-STD-750: 2031
JIS C 7021:
Reference Standard
DWG NO.
A-4
A-1
B-1
B-11
B-10
B-12
Measuring conditions
DIP Soldering (Wave Soldering)
Preheating: 120°C~150°C, within 120~180 sec.
Operation heating: 245°C ±5°C within 5 sec.
260°C (Max.)
Gradual Cooling (Avoid quenching).
Ι = 20mA
Ι = 20mA
f
f
V = 5V
120°~150°C
Soldering heat
Max. 260°C
r
Phone: [phone] or [phone] Fax: [phone]
E-mail: [e-mail]
Website: http://www.ledtronics.com
Preheat
120~180 sec.
Low T = -35°C±5°C
Test time = 1,000hrs
-35°C ~ +25°C ~ +85°C ~ +25°C
60min. 20min. 60min. 20min.
Test time = 5 cycles
-35°C±5°C ~ +85°C±5°C
20min.
Test time = 10 cycles
Preheating:
Operation heating:
Connect with a power Ι = 20mA
T = Under room temperature
Test time = 1,000hrs
T = +65°C±5°C
RH = 90%-95%
Test time = 240hrs
High T = +85°C±5°C
Test time = 1,000hrs
140°C - 160°C, within 2 minutes.
235°C (Max.), within 10 seconds. (Max.)
a
a
a
DSTR0235
a
Time
20min.
within
5 sec.
245±5°C
4°C/sec.
Max.
Test Conditions
Judgment criteria for failure
f
Below Sx0.5
Over Ux1.2
Page
Over Ux2
5 of 5
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0/20
0/20
0/20
0/20
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Result