ma4e1310 M/A-COM Technology Solutions, Inc., ma4e1310 Datasheet - Page 4

• Manufacturer Part Number: ma4e1310
• Description: Gaas Flip Chip Schottky Barrier Diode
• Manufacturer: M/A-COM Technology Solutions, Inc.

4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
GaAs Flip Chip Schottky Barrier Diode
MA4E1310
Handling Procedures
The following precautions should be observed to avoid damaging these chips:
Mounting Techniques
This device is designed to be inserted onto hard or soft substrates with the junction side down. It can be
mounted with conductive epoxy or with a low temperature solder preform. The die can also be assembled with
the junction side up, and wire or ribbon bonds made to the pads.
Solder Die Attach:
Solder which does not scavenge gold, such as Indalloy # 2, is recommended. Sn-Pb based solders are not rec-
ommended due to solder embrittlement. Do not expose die to a temperature greater than 235°C, or greater than
200°C for longer than 10 seconds. No more than three seconds of scrubbing should be required for attachment.
Epoxy Die Attach
Assembly can be preheated to 125 - 150 C. Use a minimum amount of epoxy. Cure epoxy as per manufac-
turer’s schedule. For extended cure times, temperatures should be kept below 200 C.
Cleanliness:
Static Sensitivity: Schottky barrier diodes are ESD sensitive and can be damaged by static
General Handling: The protective polymer coating on the active areas of these die provides scratch
:
The chips should be handled in a clean environment.
Do not attempt to clean die after installation.
electricity. Proper ESD techniques should be used when handling these devices.
protection, particularly for the metal air bridge which contacts the anode. Die can
be handled with tweezers or vacuum pickups and are suitable for use with
automatic pick-and-place equipment.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: [phone] / Fax: [phone]
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macomtech.com for additional data sheets and product information.
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