ma4agsbp907 M/A-COM Technology Solutions, Inc., ma4agsbp907 Datasheet - Page 2

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ma4agsbp907

Manufacturer Part Number
ma4agsbp907
Description
Algaas Solder Bump Flip-chip Diode
Manufacturer
M/A-COM Technology Solutions, Inc.
Datasheet

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2
1. Yellow areas indicate solder bumps.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
AlGaAs Solder Bump
Flip-Chip PIN Diode
MA4AGSBP907
Parameters and Test Conditions
Note:
Notes:
Reverse Breakdown Voltage at 10μA
1
2. Forward series resistance is determined by measuring single series diode insertion loss in a 50Ω line at 10GHz.
3. Reverse current will not exceed 10μA at the maximum voltage rating.
4. Switching speed is measured between 10% to 90% or 90% to10% RF voltage for a single series mounted diode. driver delay
.
Capacitance is determined by measuring single series diode isolation in a 50Ω line at 10GHz.
is not included.
Series Resistance at +10mA
Forward Voltage at +10mA
Total Capacitance at –10V
10 to 90% RF Voltage
90 to 10% RF Voltage
Switching Speed
4
4
Electrical Specifications at T
3
RoHS Compliant
Symbol
T
T
RISE
FALL
V
R
V
C
F
B
s
t
Units
Volts
Volts
pF
nS
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
DIM
1MHz & DC Specs
Visit www.macomtech.com for additional data sheets and product information.
C
D
A
B
E
F
0.025
Typ.
1.33
——-
5.2
45
AMB
0.0135
0.0065
0.0043
0.0068
0.0182
0.026
= 25°C
MIN.
Circuit Pad Layout
0.030
——-
0.008”
Max.
INCHES
(2) PL
1.45
7.0
50
0.013”
.
0.0145
0.0075
0.0053
0.0073
0.0192
MAX.
0.027
10GHz Reference Data
0.6604
0.3429
0.1651
0.1092
0.1727
0.4623
MIN.
0.025
4.2
——-
——-
Typ.
2
2
MM
0.012”
1
(2) PL
0.6858
0.3683
0.1905
0.1346
0.1854
0.4877
MAX.
Rev. V4

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