rf5511 RF Micro Devices, rf5511 Datasheet
rf5511
Manufacturer Part Number
rf5511
Description
3.3 V, Switch And Lna Front End Solution
Manufacturer
RF Micro Devices
Datasheet
1.RF5511.pdf
(2 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
RF5511
Manufacturer:
RFMD
Quantity:
5 000
Company:
Part Number:
rf5511PCBA-410
Manufacturer:
RFMD
Quantity:
5 000
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Part Number:
rf5511SB
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RFMD
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Part Number:
rf5511SR
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TST
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5 000
Features
Applications
Prelim DS090604
Single Die Front End Solution
Single Supply Voltage 3.0 V to
4.5 V
Integrated SP3T Switch and
LNA with Bypass
Typical gain is 11 dB and
1.9 dB NF in RX Mode Pin-to-
Pin
IEEE802.11b/g WLAN Appli-
cations
2.5 GHz ISM Band Applica-
tions
Portable Battery-Powered
Equipment
WLAN/Bluetooth
Devices
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
TM
Combo
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Proposed
Product Description
The RF5511 is a front end solution for high-performance WLAN applica-
tions in the 2.4 GHz to 2.5 GHz ISM band. The RF5511 addresses the need
for size reduction for a typical IEEE802.11b/g front end design and
reduces the number of components outside of the core chipset. The
RF5511 has an integrated SP3T Switch and a Low Noise Amplifier. It is
capable of switching between WLAN RX, WLAN TX, and Bluetooth
operations. The RF5511 is provided in a 1 mm x 1 mm x 0.4 mm, Flip Chip
die.
Ordering Information
RF5511
RF5511PCK-41X
GaAs HBT
GaAs MESFET
InGaP HBT
3.3 V, SWITCH AND LNA FRONT END SOLUTION
Optimum Technology Matching ® Applied
3.3 V, Switch and LNA Front End Solution
Fully Assembled Evaluation Board
SiGe BiCMOS
Si BiCMOS
SiGe HBT
Functional Block Diagram
Package Style: FLIP CHIP, 11 PIN, 1 x 1 x 0.4 mm
GaAs pHEMT
Si CMOS
Si BJT
RF5511
GaN HEMT
RF MEMS
LDMOS
TM
RX/TX
1 of 2
Related parts for rf5511
rf5511 Summary of contents
Page 1
... IEEE802.11b/g front end design and reduces the number of components outside of the core chipset. The RF5511 has an integrated SP3T Switch and a Low Noise Amplifier capable of switching between WLAN RX, WLAN TX, and Bluetooth operations. The RF5511 is provided 0.4 mm, Flip Chip die. Ordering Information RF5511 3 ...
Page 2
... RF5511 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com Proposed Please contact RFMD Technical Support at (336) 678-5570 for more information. Prelim DS090604 ...